Novel acceleration methods for electromagnetic modeling of high-speed interconnects in distribution grids ASIC

2016 ◽  
Author(s):  
Hong Sheng Xu ◽  
Jin Da Zhu ◽  
Pan Dai
Keyword(s):  
High Speed ◽  
Electromagnetic Modeling ◽  
Acceleration Methods ◽  
High Speed Interconnects ◽  
Distribution Grids

scholarly journals Analysis of the Propagation in High-Speed Interconnects for MIMICs by Means of the Method of Analytical Preconditioning: A New Highly Efficient Evaluation of the Coefficient Matrix

2021 ◽  
Vol 11 (3) ◽  
pp. 933
Author(s):  
Mario Lucido
Keyword(s):  
Integral Equation ◽  
Integrated Circuits ◽  
High Speed ◽  
Coefficient Matrix ◽  
Single Step ◽  
Integral Theorem ◽  
Acceleration Technique ◽  
Cauchy Integral Theorem ◽  
Integral Equation Formulation ◽  
High Speed Interconnects

The method of analytical preconditioning combines the discretization and the analytical regularization of a singular integral equation in a single step. In a recent paper by the author, such a method has been applied to a spectral domain integral equation formulation devised to analyze the propagation in polygonal cross-section microstrip lines, which are widely used as high-speed interconnects in monolithic microwave and millimeter waves integrated circuits. By choosing analytically Fourier transformable expansion functions reconstructing the behavior of the fields on the wedges, fast convergence is achieved, and the convolution integrals are expressed in closed form. However, the coefficient matrix elements are one-dimensional improper integrals of oscillating and, in the worst cases, slowly decaying functions. In this paper, a novel technique for the efficient evaluation of such kind of integrals is proposed. By means of a procedure based on Cauchy integral theorem, the general coefficient matrix element is written as a linear combination of fast converging integrals. As shown in the numerical results section, the proposed technique always outperforms the analytical asymptotic acceleration technique, especially when highly accurate solutions are required.

3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging

2012 ◽  
Vol 2012 (1) ◽  
pp. 001057-001067
Author(s):  
Darryl Kostka ◽  
Antonio Ciccomancini Scogna
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Form Factors ◽  
Point Of View ◽  
Electromagnetic Modeling ◽  
Electromagnetic Simulations ◽  
Full Wave ◽  
3D Ics ◽  
Silicon Vias ◽  
Delivery Networks

3D ICs promise “more than Moore” integration by packing a lot of functionality into small form factors. Interposers along with TSVs play an important role in 3D integration from an electrical, thermal and mechanical point of view. The goal of this paper is to electrically model TSVs and 3D interposers by means of three 3D full wave electromagnetic simulations. A comparative analysis of various configurations of signal delivery networks in 3D interposers for high speed signal transmission is presented.

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