RF Sputtered h-BN Thin Film Layer for Printed Circuit Boards as an Insulating Layer

2018 ◽  
Author(s):  
Remesh Kumar K.R. ◽  
K. Shreekrishna Kumar
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Insulating Layer ◽  
Printed Circuit ◽  
Thin Film Layer ◽  
Film Layer

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

scholarly journals Development and Washing Reliability Testing of a Stretchable Circuit on Knit Fabric

2020 ◽  
Vol 10 (24) ◽  
pp. 9057
Author(s):  
Paula Veske ◽  
Pieter Bauwens ◽  
Frederick Bossuyt ◽  
Tom Sterken ◽  
Jan Vanfleteren
Keyword(s):  
Printed Circuit Boards ◽  
Thermoplastic Polyurethane ◽  
Efficient Solutions ◽  
Circuit Boards ◽  
Electronic Textiles ◽  
Washing Machine ◽  
Technology Markets ◽  
Printed Circuit ◽  
Knit Fabrics ◽  
Film Layer

The smart textiles and wearable technology markets are expanding tirelessly, looking for efficient solutions to create long-lasting products. The research towards novel integration methods and increasing reliability of wearables and electronic textiles (e-textiles) is expanding. One obstacle to be tackled is the washability and the endurance to mechanical stresses in the washing machine. In this article, different layering of thermoplastic polyurethane (TPU) films and knit fabrics are used to integrate three different designs of stretchable copper-based meander tracks with printed circuit boards. The various combinations are washed according to the ISO 6330-2012 standard to analyze their endurance. Results suggest that one meander design withstands more washing cycles and indicate that the well-selected layer compositions increase the reliability. Higher stretchability together with greater durability is accomplished by adding an extra meander-shaped TPU film layer.

Miniaturization of Electromagnetic Bandgap Structures with Thin Film Dielectrics for Si Interposer Applications

2009 ◽  
Vol 1223 ◽  
Author(s):  
Koichi Takemura ◽  
Noriaki Ando ◽  
Hiroshi Toyao ◽  
Takashi Manako ◽  
Tsuneo Tsukagoshi
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Electromagnetic Bandgap ◽  
Transmission Line Theory ◽  
Printed Circuit ◽  
Unit Cell Size ◽  
Line Theory ◽  
Power Noise ◽  
Thin Film Dielectrics

ABSTRACTWe have developed miniaturized electromagnetic bandgap (EBG) structures on Si having a stopband that covers the 2.4 GHz band. By combining thin film dielectrics with inductance-enhanced EBG structures, the unit cell size can be reduced to 1 mm × 1 mm or less. Like the EBG structures embedded in conventional printed circuit boards, the stopbands can be designed using the transmission-line theory. The developed EBG structures can be integrated into Si interposers to suppress power noise.

Assessment of stability and reliability of embedded components in printed circuit boards

Circuit World ◽  
2017 ◽  
Vol 43 (1) ◽  
pp. 19-26 ◽  
Author(s):  
Wojciech Steplewski ◽  
Andrzej Dziedzic ◽  
Janusz Borecki ◽  
Tomasz Serzysko
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Environmental Conditions ◽  
Printed Circuit Boards ◽  
Thermal Exposure ◽  
Circuit Boards ◽  
Content Type ◽  
Embedded Capacitors ◽  
Printed Circuit ◽  
Thin Film Resistors

Purpose The purpose of this paper is to investigate the basic functional parameters of passive embedded components in printed circuit boards (PCBs) under environmental exposures such as thermal-humidity and thermal exposure. Design/methodology/approach The investigations were based on the thin-film resistors made of NiP alloy, thick-film resistors made of carbon or carbon–silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. The capacitors and thin- and thick-film resistors were tested in the climatic chamber in conditions of thermal-humidity exposure at 85°C and 85 per cent RH for 500 h. The embedded inductors were tested in two different environmental conditions: thermal-humidity exposure at 60°C and 95 per cent RH, and thermal exposure at 150°C and additionally at the temperature in the range of +25°C to +150°C. Findings Studies show that in the case of embedded capacitors, the changes caused by exposure to thermal-humidity are durable and lead to the capacity increase. The embedded thin-film resistors behave in the same manner, whereas the thick-film resistors were the least resistant to the conditions of exposure. Most of the polymer thick-film resistors have been damaged. The changes of coils' properties during aging are small, and what is most important is that, after some time of exposure, their parameters stabilize at a particular level. The changes resulting from the increase in temperature are typically related to the change of material resistance (Cu) of which coils are made, and as such, they cannot be avoided but they can be predicted. Research limitations/implications The realized studies allowed determination of the properties of the embedded passive elements with respect to specific environmental exposures. The studies show that embedded resistors can be used interchangeably with chip passive elements. It allows saving the area on the surface of PCB, occupied by these passive elements, for assembly of active elements integrated circuits (ICs) and thus enabling the miniaturization of electronic devices. Originality/value The knowledge about the behavior of the operating parameters of embedded components, considering the environmental conditions, allows for development of more complex systems with integrated PCBs.

Evaluation System for Ionic Migration On/In the Superconnect Leveled Printed Circuit Board by Means of AC Impedance Method

2005 ◽  
Author(s):  
Sachio Yoshihara
Keyword(s):  
Evaluation System ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Ac Impedance ◽  
Circuit Board ◽  
Impedance Method ◽  
Circuit Boards ◽  
Insulating Layer ◽  
Printed Circuit ◽  
Environmental Friendly

Micro-fabricated Printed Circuit Boards (PCB) using environmental friendly materials and processes will be desirable candidates for future electronic packaging technologies. To investigate the ionic migration for thus developed PCB, quite new measurement method has been developed by the authors, which enables real time monitoring of the growth process of ionic migration using AC impedance method. Electric reliability of the newly developed copper printed circuit boards by Japan NEDO project (L/S = 4/6, 8/12, 12/16 μm) using polyimide, etc as the insulating layer have been evaluated under 85°C, 85%RH. The generation of the migration was also tested by conventional time dependence of current under bias of 5.0 V or 100 V. The progress of the migration could be investigated by AC Impedance method (Cole-Cole plots). The degradation of the diameter of the impedance loop suggested the intimation of migrations.

Thermal stability analysis of passive components embedded into printed circuit boards

Circuit World ◽  
2018 ◽  
Vol 44 (1) ◽  
pp. 29-36
Author(s):  
Wojciech Stęplewski ◽  
Andrzej Dziedzic ◽  
Kamil Janeczek ◽  
Aneta Araźna ◽  
Krzysztof Lipiec ◽  
...  
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Content Type ◽  
Temperature Changes ◽  
Embedded Capacitors ◽  
Printed Circuit ◽  
Embedded Passives ◽  
Thin Film Resistors

Purpose The purpose of this paper is to investigate the behavior of embedded passives under changing temperature conditions. Influence of different temperature changes on the basic properties of embedded passives was analyzed. The main reason for these investigations was to determine functionality of passives for space application. Design/methodology/approach The investigations were based on the thin-film resistors made of Ni-P alloy, thick-film resistors made of carbon or carbon-silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. Prepared samples were examined under the influence of a constant elevated temperature (100, 130 or 160°C) in a long period of time (minimum of 30 h), thermal cycles (from −40 to +85°C) or thermal shocks (from −40 to +105°C or from −40 to +125°C). Findings The achieved results revealed that resistance drift became bigger when the samples were treated at a higher constant temperature. At the same time, no significant difference in change in electrical properties for 50 and 100 Ω resistors was noticed. For all the tests, resistance change was below 2 per cent regardless of a value of the tested resistors. Conducted thermal shock studies indicate that thin-film resistors, coils and some thick-film resistors are characterized by minor variations in basic parameters. Some of the inks may show considerable resistance variations with temperature changes. Significant changes were also exhibited by embedded capacitors. Originality/value The knowledge about the behavior of the operating parameters of embedded components considering environmental conditions allow for development of more complex systems with integrated printed circuit boards.

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