3D IC Memory BIST Controller Allocation for Test Time Minimization Under Power Constraints

Author(s):  
Yen-Chun Ko ◽  
Shih-Hsu Huang
2006 ◽  
Vol 21 (6) ◽  
pp. 907-912 ◽  
Author(s):  
Gert Jervan ◽  
Petru Eles ◽  
Zebo Peng ◽  
Raimund Ubar ◽  
Maksim Jenihhin
Keyword(s):  

Author(s):  
Riccardo Cantoro ◽  
Marco Palena ◽  
Paolo Pasini ◽  
Matteo Sonza Reorda
Keyword(s):  

2012 ◽  
Vol 2012 ◽  
pp. 1-10 ◽  
Author(s):  
Chi-Jih Shih ◽  
Chih-Yao Hsu ◽  
Chun-Yi Kuo ◽  
James Li ◽  
Jiann-Chyi Rau ◽  
...  

Testing is regarded as one of the most difficult challenges for three-dimensional integrated circuits (3D ICs). In this paper, we want to optimize the cost of TAM (test access mechanism) and the test time for 3D IC. We used both greedy and simulated annealing algorithms to solve this optimization problem. We compare the results of two assumptions:soft-die modeandhard-die mode. The former assumes that the DfT of dies cannot be changed, while the latter assumes that the DfT of dies can be adjusted. The results show that thermal-aware cooptimization is essential to decide the optimal TAM and test schedule. Blindly adding TAM cannot reduce the total test cost due to temperature constraints. Another conclusion is that soft-die mode is more effective than hard-die mode to reduce the total test cost for 3D IC.


Author(s):  
Zhiyuan He ◽  
Zebo Peng ◽  
Petru Eles

High temperature has become a technological barrier to the testing of high performance systems-on-chip, especially when deep submicron technologies are employed. In order to reduce test time while keeping the temperature of the cores under test within a safe range, thermal-aware test scheduling techniques are required. In this chapter, the authors address the test time minimization problem as how to generate the shortest test schedule such that the temperature limits of individual cores and the limit on the test-bus bandwidth are satisfied. In order to avoid overheating during the test, the authors partition test sets into shorter test sub-sequences and add cooling periods in between, such that applying a test sub-sequence will not drive the core temperature going beyond the limit. Furthermore, based on the test partitioning scheme, the authors interleave the test sub-sequences from different test sets in such a manner that a cooling period reserved for one core is utilized for the test transportation and application of another core. The authors have proposed an approach to minimize the test application time by exploring alternative test partitioning and interleaving schemes with variable length of test sub-sequences and cooling periods as well as alternative test schedules. Experimental results have shown the efficiency of the proposed approach.


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