An Optimum ORA BIST for Multiple Fault FPGA Look-Up Table Testing

A High Efficiency Class-E Power Amplifier Over a Wide Power Range Using a Look-Up Table Based Dynamic Biasing Scheme

IEICE Transactions on Electronics ◽

10.1587/transele.e98.c.377 ◽

2015 ◽

Vol E98.C (4) ◽

pp. 377-379

Author(s):

Jonggyun LIM ◽

Wonshil KANG ◽

Kang-Yoon LEE ◽

Hyunchul KU

Keyword(s):

Power Amplifier ◽

High Efficiency ◽

Look Up Table ◽

Dynamic Biasing ◽

Class E

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Multiple fault diagnosis for hydraulic systems using Nearest-centroid-with-DBA and Random-Forest-based-time-series-classification

2020 39th Chinese Control Conference (CCC) ◽

10.23919/ccc50068.2020.9189401 ◽

2020 ◽

Author(s):

Zhijie Peng ◽

Ke Zhang ◽

Yi Chai

Keyword(s):

Time Series ◽

Fault Diagnosis ◽

Random Forest ◽

Time Series Classification ◽

Hydraulic Systems ◽

Multiple Fault ◽

Multiple Fault Diagnosis

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Assessment of the look-up table using the tubular and bundle CHF data and modification of the bundle correction factor

Kerntechnik ◽

10.3139/124.100293 ◽

2006 ◽

Vol 71 (4) ◽

pp. 192-202

Author(s):

D. K. Chandraker ◽

P. K. Vijayan ◽

D. Saha ◽

R. K. Sinha

Keyword(s):

Correction Factor ◽

Look Up Table ◽

The Look

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Magnetic Current Imaging Power Short Localization

ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2015p0222 ◽

2015 ◽

Author(s):

J. Gaudestad ◽

F. Rusli ◽

A. Orozco ◽

M.C. Pun

Keyword(s):

Thermal Imaging ◽

Flip Chip ◽

Optical Microscope ◽

Fault Isolation ◽

Magnetic Current ◽

Multiple Fault ◽

Defect Location ◽

Isolation Techniques ◽

Chip Sample

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.

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