Process-window sensitive full-chip inspection for design-tosilicon optimization in the sub-wavelength era

Author(s):  
Scott Halle MaryJane Brodsky
2005 ◽  
Author(s):  
Mary Jane Brodsky ◽  
Scott Halle ◽  
Vickie Jophlin-Gut ◽  
Lars Liebmann ◽  
Don Samuels ◽  
...  

2003 ◽  
Vol 766 ◽  
Author(s):  
J. Gambino ◽  
T. Stamper ◽  
H. Trombley ◽  
S. Luce ◽  
F. Allen ◽  
...  

AbstractA trench-first dual damascene process has been developed for fat wires (1.26 μm pitch, 1.1 μm thickness) in a 0.18 μm CMOS process with copper/fluorosilicate glass (FSG) interconnect technology. The process window for the patterning of vias in such deep trenches depends on the trench depth and on the line width of the trench, with the worse case being an intermediate line width (lines that are 3X the via diameter). Compared to a single damascene process, the dual damascene process has comparable yield and reliability, with lower via resistance and lower cost.


PIERS Online ◽  
2005 ◽  
Vol 1 (1) ◽  
pp. 37-41 ◽  
Author(s):  
Pavel A. Belov ◽  
C. R. Simovski

2020 ◽  
Vol 96 (3s) ◽  
pp. 756-757
Author(s):  
Е.С. Шамин ◽  
Е.Л. Харченко

Данная работа посвящена описанию возможного алгоритма создания моделей резиста с постоянным порогом и расчета окон процесса на их основе. Приведенные изыскания реализованы в виде программного средства, использующего средства моделирования фотолитографии Mentor Graphics Calibre. This work is dedicated to the description of one of possible algorithms of constant threshold resist model generation used for photolithography process window calculation. This algorithm has been realized in the form of a program using Mentor Graphics Calibre modeling tools.


Author(s):  
Baichun Zhang ◽  
Jianguo Yang ◽  
Lei Sun ◽  
Quanbo Li ◽  
Jun Huang ◽  
...  
Keyword(s):  

Nanophotonics ◽  
2020 ◽  
Vol 9 (4) ◽  
pp. 897-903 ◽  
Author(s):  
Oleksandr Buchnev ◽  
Alexandr Belosludtsev ◽  
Victor Reshetnyak ◽  
Dean R. Evans ◽  
Vassili A. Fedotov

AbstractWe demonstrate experimentally that Tamm plasmons in the near infrared can be supported by a dielectric mirror interfaced with a metasurface, a discontinuous thin metal film periodically patterned on the sub-wavelength scale. More crucially, not only do Tamm plasmons survive the nanopatterning of the metal film but they also become sensitive to external perturbations as a result. In particular, by depositing a nematic liquid crystal on the outer side of the metasurface, we were able to red shift the spectral position of Tamm plasmon by 35 nm, while electrical switching of the liquid crystal enabled us to tune the wavelength of this notoriously inert excitation within a 10-nm range.


2021 ◽  
Vol 197 ◽  
pp. 106308
Author(s):  
Yijie Liu ◽  
Liang Jin ◽  
Hongfa Wang ◽  
Dongying Liu ◽  
Yingjing Liang

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