Measured and simulated electric, magnetic, and thermal field distributions of a patch antenna operating at high power

2003 ◽  
Author(s):  
R.M. Reano ◽  
W. Thiel ◽  
J.F. Whitaker ◽  
L.P.B. Katehi
Keyword(s):  
High Power ◽  
Patch Antenna ◽  
Thermal Field ◽  
Field Distributions

Placement Optimization for Thermal Performance of Embedded Power Chip Microwave Modules Using BP-GA

2011 ◽  
Vol 189-193 ◽  
pp. 639-642
Author(s):  
Sheng Zhang ◽  
Zhao Hua Wu ◽  
Hong Yan Huang ◽  
Pin Chen ◽  
Tang Wen Bi
Keyword(s):  
Finite Element Analysis ◽  
Temperature Field ◽  
Thermal Field ◽  
Thermal Design ◽  
Internal Temperature ◽  
Element Analysis ◽  
Thermal Distribution ◽  
Placement Optimization ◽  
Field Distributions ◽  
Embedded Power

In the thermal design of Embedded Power Chip Microwave Modules, the placement of chips on substrate has a significant effect on internal temperature field, thus, influence the reliability of the modules. In this paper, Based on BP-GA, the optimization for chips placement of EPCM is achieved by corresponding optimization program. To demonstrate the effectiveness of the results, ANSYS, finite element analysis (FEA) is carried out to assess the thermal field distribution of the optimization for chips placement. The result shows that the thermal field distributions of the optimization are consistent with the FEA results. The internal highest temperature of the initial placements is 90.369°C. After optimization, the internal highest temperature is 86.128°C, the highest temperature be reduced more than 5°C. It can effectively deal with the problem about optimize the thermal placement of EPCM chips, and improves the internal thermal distribution.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Radiation characteristics of high power mesoband patch antenna array

2010 ◽  
Vol 22 (12) ◽  
pp. 2955-2958
Author(s):  
徐刚 Xu Gang ◽  
廖勇 Liao Yong ◽  
谢平 Xie Ping ◽  
孟凡宝 Meng Fanbao ◽  
唐传祥 Tang Chuanxiang
Keyword(s):  
Antenna Array ◽  
High Power ◽  
Patch Antenna ◽  
Radiation Characteristics

Thermal Field Distributions of Ablative Experiments Using Cyst-mimicking Phantoms

2018 ◽  
Vol 25 (5) ◽  
pp. 636-642 ◽  
Author(s):  
Xiao-wen Huang ◽  
Fang Nie ◽  
Zeng-cheng Wa ◽  
Hang-tong Hu ◽  
Qing-xiu Huang ◽  
...  
Keyword(s):  
Thermal Field ◽  
Field Distributions
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