Thermal field modeling algorithm based on flexible space division for high-power, high-precision mechatronic systems

2014 ◽  
Author(s):  
Li Man Yang ◽  
Kok-Meng Lee ◽  
Kun Bai
Keyword(s):  
High Precision ◽  
High Power ◽  
Thermal Field ◽  
Mechatronic Systems ◽  
Space Division ◽  
Field Modeling ◽  
Modeling Algorithm

High-precision active synchronization control of high-power, tiled-aperture coherent beam combining

2017 ◽  
Vol 42 (19) ◽  
pp. 3960 ◽  
Author(s):  
Chun Peng ◽  
Xiaoyan Liang ◽  
Renqi Liu ◽  
Wenqi Li ◽  
Ruxin Li
Keyword(s):  
High Precision ◽  
High Power ◽  
Coherent Beam ◽  
Synchronization Control ◽  
Coherent Beam Combining ◽  
Beam Combining

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

scholarly journals 3D thermal field modelling in electromagnetic gripping system

2019 ◽  
Vol 28 ◽  
pp. 01012
Author(s):  
Mariusz Barański ◽  
Krystian Glapa
Keyword(s):  
Steady State ◽  
Field Distribution ◽  
Thermal Field ◽  
Walking Robot ◽  
Field Modelling ◽  
Field Modeling

In this paper, 3D steady-state thermal field modeling in electromagnetic gripping system using Comsol Multiphisics was presented. The electromagnetic gripping system, which is a component of the mechanical leg of a walking robot was designed by the authors. An algorithm to design of the electromagnetic gripping was developed. During calculations, the influence of the value of the current on the thermal field distribution in steady-state was carried out. Selected results of simulations as well as the analysis of these results were presented.

High-power picosecond laser diodes based on different methods of fast gain control for high-precision radar applications

2007 ◽  
Author(s):  
Sergey Vainshtein ◽  
Juha Kostamovaara ◽  
Vladimir Lantratov ◽  
Nikolay Kaluzhniy ◽  
Sergey Mintairov
Keyword(s):  
High Precision ◽  
High Power ◽  
Laser Diodes ◽  
Gain Control ◽  
Picosecond Laser ◽  
Radar Applications

A Methodology for Remote Debug, Test and Maintenance Based on IEEE 1588

2011 ◽  
Author(s):  
Peter Ro¨ssler ◽  
Roland Ho¨ller ◽  
Martin Zauner
Keyword(s):  
High Precision ◽  
Clock Synchronization ◽  
Automotive Electronics ◽  
Mechatronic Systems ◽  
Ieee 1588 ◽  
Remote Testing ◽  
Synchronization Protocol ◽  
Precision Clock

This work describes a new methodology for the purpose of remote testing, debugging and maintenance of networked electronic and mechatronic systems which makes use of the IEEE 1588 high-precision clock synchronization protocol. After the underlying concepts of IEEE 1588 are briefly sketched, the paper describes how functionalities like testing, debugging and maintenance can benefit from a network-wide notion of time as provided by the IEEE 1588 standard. An implementation of the IEEE 1588 protocol with support for test, debug and maintenance as well as links to the integration of the proposed concept into existing tools are presented. Further, the proposed approach is discussed under consideration of recent standardization efforts. Finally, a case study from the area of automotive electronics is described.

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