A low loss branch line coupler based on substrate integrated suspended line (SISL) technology and double-sided interconnected strip line (DSISL)

Author(s):  
Yongqiang Wang ◽  
Kaixue Ma ◽  
Shouxian Mou ◽  
Ningning Yan ◽  
Lianyue Li
Keyword(s):  
Low Loss ◽  
Author(s):  
Jay W. McDaniel ◽  
Shahrokh Saeedi ◽  
Mark B. Yeary ◽  
Hjalti H. Sigmarsson

1986 ◽  
Vol 72 ◽  
Author(s):  
L. E. Cross ◽  
T. R. Gururaja

AbstractTo accomplish the interconnect systems which will be required in the next generation of very high speed Ga:As digital ICs, it will be necessary to use strip line techniques for signal traces which must be deposited over very low permittivity dielectric substration. Materials with relative dielectric permittivities k 〈 3.0 and very low loss tangent up to microwave frequencies will be required. For ceramic systems such values are impossible to achieve in single phase monoliths, and composite approaches are required. Techniques for processing ceramic insulators which permit the introduction of controlled pore structures are discussed. The introduction of pores degrades some other desirable properties of the ceramic such as mechanical strength and thermal conductivity so that control of both scale and location of pores is desirable.Materials investigated include sol-gel processed silica films and monoliths, reactively sputtered silica, etched glass compositions and Macro-Defect-Free (MDF) cements.


2011 ◽  
Vol 53 (10) ◽  
pp. 2400-2403 ◽  
Author(s):  
Hoang Nguyen Van ◽  
Tuan Hoang Anh ◽  
Jin-Ho Kim ◽  
Yong-Huyn Baek ◽  
Sang-Jin Lee ◽  
...  
Keyword(s):  
Low Loss ◽  

2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000302-000305
Author(s):  
Steve Dai ◽  
Adrian Casias

GreenTape™ 9K7 low temperature cofired ceramic (LTCC) is a low loss glass ceramic dielectric tape for high frequency applications. The low loss is mainly achieved via glass-derived and glass-reacted crystallizations that occur during the sintering stage. This paper reports on the impact of one critical process parameter, the ramp rate from the binder burnout to the sintering temperature (530 – 850°C), which affects the shrinkage behavior, dielectric properties and strip line (SL) resonator characteristics of 9K7. At slow ramp rates crystallization occurs before densification, increasing glass viscosity, and thus inhibiting 9k7 from reaching full density. The sintering of 9k7 can be optimized using ramp rates that allow densification prior to crystallization.


2012 ◽  
Vol 54 (8) ◽  
pp. 1898-1900 ◽  
Author(s):  
Jung-Kyu Lee ◽  
Dong-Jin Jung ◽  
Kai Chang

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