Analytical study of temperature distribution of one-layer EM-absorber using a lossy dielectric material

2006 ◽  
Author(s):  
Shinya Watanabe ◽  
Kota Saito ◽  
Takahiro Kurakata ◽  
Osamu Hashimoto
Keyword(s):  
Temperature Distribution ◽  
Analytical Study ◽  
Dielectric Material ◽  
Lossy Dielectric

The Relation of Temperature Distribution on Silicon Wafer with Furnace Temperature and Gas Flow during Thermal Dry Oxidation Process

2015 ◽  
Vol 1109 ◽  
pp. 6-10
Author(s):  
A.H. Azman ◽  
S. Norhafizah ◽  
R.M. Ayub ◽  
Mohd Khairuddin Md Arshad ◽  
M.F.M. Fathil ◽  
...  
Keyword(s):  
Temperature Distribution ◽  
Flow Rate ◽  
Gas Flow ◽  
Gate Dielectric ◽  
Oxidation Process ◽  
Dielectric Material ◽  
Furnace Temperature ◽  
Silicon Dioxide Film ◽  
Wafer Temperature ◽  
Device Technology

Silicon dioxide film has been used as the gate dielectric material in MOS device technology for decades. The film is normally grown in a diffusion furnace using a dry thermal oxidation process. As the device is scaled down to nanometer dimensions, the SiO2 film uniformity requirement is more stringent than ever. In this paper, the effect of furnace temperature and the flow rate of oxygen gas on wafer temperature distribution was investigated. The result was recorded by using the Infrared Thermometer with Dual Laser Targeting device (IRT5000). We have found that the uniformity of temperature distribution on the wafer is almost directly proportional to the O2 flow rate for the entire furnace temperature range (900 - 1050°C). On the other hand, the effect of O2 flow rate on wafer temperature distributions clearly shows two distinct regions; for furnace temperatures of less than 1000 °C, the higher the O2 flow rate, the better the uniformity. For the furnace temperatures of more than 1000 °C, we did not observe any clear dependency of wafer temperature distribution on O2 flow rate.

Analytical study of temperature distribution in a rectangular porous fin considering both insulated and convective tip

2017 ◽  
Author(s):  
Tuhin Deshamukhya ◽  
Dipankar Bhanja ◽  
Sujit Nath ◽  
Ambarish Maji ◽  
Gautam Choubey
Keyword(s):  
Temperature Distribution ◽  
Analytical Study ◽  
Porous Fin

Analytical Study of Heat and Mass Transfer in Porous Sheets During Contact Drying Process

2008 ◽  
Author(s):  
Mohammad R. Izadpanah ◽  
Amir R. Ansari Dezfooli
Keyword(s):  
Mass Transfer ◽  
Temperature Distribution ◽  
Moisture Content ◽  
Close Agreement ◽  
Analytical Study ◽  
Numerical Data ◽  
Drying Process ◽  
Governing Equations ◽  
Sturm Liouville ◽  
Contact Drying

Contact drying process has gained wide application in different industries including paper, ceramics and construction industries. Suitable control over temperature distribution will result in required moisture content and its distribution. In the present study, governing equations for a porous sheet are derived using Luikov equation. These equations are then converted into sturm-liouville equations and solved simultaneously. Comparison of temperature and moisture distributions with numerical data shows a close agreement.

Heat Transfer of Thin Fins With Temperature-Dependent Thermal Properties and Internal Heat Generation

1967 ◽  
Vol 89 (2) ◽  
pp. 155-162 ◽  
Author(s):  
H. M. Hung ◽  
F. C. Appl
Keyword(s):  
Heat Transfer ◽  
Thermal Properties ◽  
Temperature Distribution ◽  
Heat Generation ◽  
Analytical Study ◽  
Internal Heat ◽  
Internal Heat Generation ◽  
Temperature Dependent ◽  
Numerical Examples

An analytical study of the temperature distribution along thin fins with temperature-dependent thermal properties and internal heat generation is presented. The analysis utilizes a recently published bounding procedure which yields analytical and continuous bounding functions for the temperature distribution. Several numerical examples are considered. Tabular and graphical results are given. The effects of variable thermal properties and internal heat generation are also shown.

scholarly journals Analytical study of the temperature distribution in solids subjected to nonuniform moving heat sources

2013 ◽  
Vol 17 (3) ◽  
pp. 687-694 ◽  
Author(s):  
Mohamed Hamraoui ◽  
Mounir Chbiki ◽  
Najib Laraqi ◽  
Luis Roseiro
Keyword(s):  
Steady State ◽  
Temperature Distribution ◽  
Power Dissipation ◽  
Relative Velocity ◽  
Analytical Study ◽  
Three Dimensional ◽  
Total Power ◽  
Heat Sources ◽  
Reference Case ◽  
Made In

We propose in this paper an analytical study of the temperature distribution in a solid subjected to moving heat sources. The power dissipated by the heat sources is considered nonuniform. The study was made in steady state. The model is three-dimensional. It is valid regardless of the relative velocity of the source. We have considered three cases of semi-elliptic distribution of the power with: (i) the maximum at the center of the source, (ii) the maximum at the inlet of the source, (iii) the maximum at the output of the source. These configurations simulate the conformity imperfection of contact due to wear and / or the non-uniformity of contact pressure in frictional devices. We compare the temperature change for these different scenarios and for different relative velocities, considering the same total power dissipation. The reference case is that of a uniform source dissipating the same power.

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

2016 ◽  
Vol 138 (2) ◽  
Author(s):  
M. Baris Dogruoz
Keyword(s):  
Thermal Conductivity ◽  
Temperature Distribution ◽  
Joule Heating ◽  
Computer Aided Design ◽  
Printed Circuit Boards ◽  
Dielectric Material ◽  
Circuit Board ◽  
System Level ◽  
Cfd Simulations ◽  
Printed Circuit

A printed circuit board (PCB) comprises a solid piece of dielectric material with embedded layers of current carrying metal traces and vias. Geometric features of these metal traces and vias in modern PCBs are highly nonuniform and complicated such that the card level or system level numerical simulations by using the actual trace and via geometries are computationally expensive. The present study investigates the effects of Joule heating in current carrying traces on the temperature distribution of PCBs by conducting one-way and two-way direct current (DC) electric and computational fluid dynamics (CFD) simulations. DC electric field simulations are performed to determine the power map of trace layers which are modeled as planar heat generating sources by using the temperature-dependent electrical conductivity of the metal trace. The power distribution varies with the implemented size and power thresholds. Thermal conductivity map of the PCB is determined by using the electronic computer-aided design (ECAD) images of the individual layers. By using these planar source and thermal conductivity maps, CFD simulations are conducted to determine the resulting temperature distribution on the board. A methodology is developed and applied to a sample, complex PCB, and the generated results are compared with those of the previous studies and conventional models. The computational data show that the temperature distributions over the PCB and its mounted components experience large variations based on the implemented thermal conductivity mapping and the Joule heating modeling technique.

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