scholarly journals D3PointNet: Dual-Level Defect Detection PointNet for Solder Paste Printer in Surface Mount Technology

IEEE Access ◽  
2020 ◽  
Vol 8 ◽  
pp. 140310-140322
Author(s):  
Jin-Man Park ◽  
Yong-Ho Yoo ◽  
Ue-Hwan Kim ◽  
Dukyoung Lee ◽  
Jong-Hwan Kim
Keyword(s):  
Defect Detection ◽  
Surface Mount Technology ◽  
Solder Paste ◽  
Surface Mount

A Novel Placement Method for Mini-Scale Passive Components in Surface Mount Technology

2021 ◽  
Author(s):  
Jingxi He ◽  
Yuqiao Cen ◽  
Yuanyuan Li ◽  
Shrouq Alelaumi ◽  
Daehan Won
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Superior Performance ◽  
Surface Mount Technology ◽  
Solder Paste ◽  
Passive Components ◽  
Surface Mount ◽  
Placement Method ◽  
Pick And Place ◽  
Comparative Results

Abstract This paper aims to propose a novel placing method, i.e., place-between-paste-and-pad (PB), for mini-scale passive components to enhance electronic assembly lines' yield. PB means a component is designed to be placed at the midpoint between the pastes and pads on the length direction while it aligns with the pads' center on the width direction. An experiment that involves 12 printed circuit boards (PCB) is designed and conducted to get comparative results. Four PCBs are employed for place-on-pad (PP), place-on-paste (PPS), and PB separately. On each board, 375 resistors R0402M (0.40 mm X 0.20 mm) are assembled horizontally. To study the components' misalignment under various solder paste offset conditions in different placement methods, a stencil with 25 solder paste offset settings is utilized. Based on this experiment's results, PB has superior performance to the other two methods to minimize components' misalignment. Regarding the number of acceptable components when post-reflow offsets are within 25% of components' dimensions, PB and PP have equivalent performances, and they both outperform PPS. Furthermore, PB is a low-cost placing strategy because PB needs not the real-time communication between the solder paste inspection machine and the pick-and-place machine. With the miniaturization trend in electronic products, the post-reflow components' misalignment is more frequently observed than before. The placement method proposed in this study is expected to offer a low-cost exploration in the component pick-and-place procedure to enhance the surface mount technology (SMT) assembly quality.

scholarly journals Effect of Temperature on Solder Paste During Surface Mount Technology Printing

2020 ◽  
Vol 75 (3) ◽  
pp. 99-107
Author(s):  
Nur Hidayah Mansor ◽  
Mohd Sharizal Abdul Aziz ◽  
Nina Amanina Marji ◽  
Mohd Arif Anuar Mohd Salleh
Keyword(s):  
Effect Of Temperature ◽  
Surface Mount Technology ◽  
Solder Paste ◽  
Surface Mount
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