scholarly journals Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using Magnetic Resonance Coupling for Stress Free Polishing Application

IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 75330-75341 ◽  
Author(s):  
Zilian Qu ◽  
Wensong Wang ◽  
Shuhui Yang ◽  
Quqin Sun ◽  
Zhongyuan Fang ◽  
...  
Author(s):  
Sayemul Islam ◽  
Rajpreet Kaur Gulati ◽  
Michael Domic ◽  
Amitangshu Pal ◽  
Krishna Kant ◽  
...  

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