Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using Magnetic Resonance Coupling for Stress Free Polishing Application
Keyword(s):
Cu Film
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2014 ◽
Vol 134
(5)
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pp. 564-574
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2016 ◽
Vol 136
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pp. 222-231
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2015 ◽
Vol 135
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pp. 182-191
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2014 ◽
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pp. 892-900
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