A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation
2012 ◽
Vol 217-219
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pp. 1998-2001
2000 ◽
2018 ◽
Vol 59
(s2)
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pp. E152-E160
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2000 ◽
Keyword(s):
2014 ◽
Vol 1038
◽
pp. 11-17
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