scholarly journals Particle Filtering for Prognostics of a Newly Designed Product With a New Parameters Initialization Strategy Based on Reliability Test Data

IEEE Access ◽  
2018 ◽  
Vol 6 ◽  
pp. 62564-62573 ◽  
Author(s):  
Jie Liu ◽  
Enrico Zio ◽  
Yang Hu
Keyword(s):  
Test Data ◽  
Particle Filtering ◽  
Reliability Test ◽  
Initialization Strategy

Durability and Reliability Test Planning and Test Data Analysis

2013 ◽  
Vol 7 (1) ◽  
pp. 84-95
Author(s):  
Zhigang Wei ◽  
Shengbin Lin ◽  
Limin Luo ◽  
Fulun Yang ◽  
Dmitri Konson ◽  
...  
Keyword(s):  
Data Analysis ◽  
Test Data ◽  
Reliability Test ◽  
Test Planning

Design of a Zero-Failure Reliability Test Plan Based on Customer Usage and Bench Life Test Data

2006 ◽  
Vol 49 (2) ◽  
pp. 93-103
Author(s):  
Jianxiong Chen ◽  
Wenzhen Yan
Keyword(s):  
Monte Carlo Simulation ◽  
Test Data ◽  
New Products ◽  
Test Method ◽  
Reliability Test ◽  
Distribution Analysis ◽  
Test Plan ◽  
Life Test ◽  
Product Service

Reliability tests are mandatory to evaluate new products prior to their release. The proper determination of a reliability test plan is crucial because an erroneous test plan can be very costly and misleading. This paper describes a probability-based method of designing a reliability demonstration test plan using both field customer usage and historical bench life test data. Statistical distribution analysis, Monte Carlo simulation (MCS) technique, and zero-failure test method are integrated into the probability-based method to create test plans that can more accurately evaluate product reliabilities for the required product service life using a small number of test samples.

scholarly journals PENGARUH FAKTOR PSIKOGRAFIS TERHADAP KEPUTUSAN PEMBELIAN SEPATU MEREK MOLLINIC DI PT. RAMAYANA LESTARI SENTOSA, TBK PADANG

2019 ◽  
Author(s):  
Fisesra ◽  
Febsri Susanti
Keyword(s):  
Regression Analysis ◽  
Social Class ◽  
Multiple Regression Analysis ◽  
Multiple Regression ◽  
Test Data ◽  
Hypothesis Test ◽  
Descriptive Analysis ◽  
Test Reliability ◽  
Purchase Decision ◽  
Reliability Test

This study aims to determine whether there is influence of psychographical factors consisting of lifestyle, personality and social class on the purchase decision of mollinic brand shoes on pt Ramayana lestari sentosa tbk padang.Technique of data collecting is done by way of 100 concurrent spreading at consumer who buy mollinic brand shoes which is in ramayan lestari sentosa tbk padang. The analysis tools used are validity test, reliability test, descriptive analysis, classical assumption test, multiple regression analysis and hypothesis test. Data is processed through spss application 16. The result of regression equation is obtained: Y = 3,468 + 0,338 X1 + 0,382X2 + 0,103X3 + eBased on the results of the analysis of the calculated f count of 66.072 significant 0.000a, adjusted R square value is 0.664 and hypothesis test through t test on lifestyle obtained tcount (4,728)> t table 1.660, terhepap personality titung (4.302)> t table and against social class is tcount 1.128

BGA Board Level Reliability Analysis & Optimization

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 000958-000972
Author(s):  
Betty Yeung
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Finite Element Modeling ◽  
Test Data ◽  
Cycle Time ◽  
Temperature Cycling ◽  
Reliability Test ◽  
Element Modeling ◽  
Simulation Procedure ◽  
Bga Package

The solder joint reliability of semiconductor package interconnects to printed circuit boards is critical for product durability. A dominant failure mode is solder fatigue due to the CTE mismatch between the BGA component and PCB at thermal cycling. However, it is well known that other factors can impact fatigue behavior and time to failure such as solder joint geometry, die geometry, solder system, etc. Finite element modeling (FEM) and simulation can play an integral role in providing deeper insight into the impact of these package parameters on the overall assembly. However, a major challenge of accurately modeling these systems includes simulation of multiple length scales from the package, substrate, and solder joints. The FEM approach addressing these can lead to reduced cycle time, accurate simulation, and improved package performance. In this work, the finite element modeling and simulation procedure is demonstrated for a BGA package at accelerated temperature cycling conditions. At the component level, key details regarding the properties and constituents of the BGA package mold compound and substrate are established by coupling measured experimental warpage data and finite element modeling. Comparison of simulated & Thermoire measurements shows excellent agreement at the package level, with warpage correlation achieved over the entire temperature range. At the assembly level, the truncated sphere model is used to arrive at precise solder joint profiles for accurate representation to tie the package to the board. The combined validated package-level results and solder joint profiles are employed towards a subsequent thermo-mechanical analysis of the full BGA assembly. The entire simulation procedure is demonstrated for a BGA design, where inelastic creep and reliability test data are compared. High strain regions in the solder joint array are shown to compare closely with regions of failure from experimental reliability test data. The validated FEM model allows for extrapolating to similar package conditions allowing faster design cycle time and less time consuming experimental work.

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