scholarly journals A Novel Low-Loss Millimeter-Wave 3-dB 90° Ridge-Gap Coupler Using Large Aperture Progressive Phase Compensation

IEEE Access ◽  
2017 ◽  
Vol 5 ◽  
pp. 9610-9618 ◽  
Author(s):  
Mohammadmahdi Farahani ◽  
Mohammad Akbari ◽  
Mourad Nedil ◽  
Tayeb A. Denidni ◽  
Abdel R. Sebak
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
Phase Compensation ◽  
Large Aperture

Low-Loss 3D-Coplanar Line Structure for Millimeter Wave Applications Using Laser Direct Structuring Technology

2021 ◽  
Author(s):  
S. Seewald ◽  
D. Manteuffel ◽  
M. Wolf ◽  
M. Barth ◽  
W. Eberhardt ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
Coplanar Line ◽  
Line Structure

A low-loss compact stripline low-pass filter for millimeter-wave applications

2016 ◽  
Author(s):  
A. Gomez-Torrent ◽  
I. Arregui ◽  
J.D. Martinez ◽  
F. Teberio ◽  
J. V. M. Sanchez de Rojas ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
Pass Filter ◽  
Low Pass Filter ◽  
Low Pass

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris
Keyword(s):  
3D Printing ◽  
Millimeter Wave ◽  
Integrated Circuit ◽  
Coplanar Waveguide ◽  
Frequency Selective Surface ◽  
60 Ghz ◽  
Low Loss ◽  
Printing Technology ◽  
3D Printing Technology ◽  
Application Specific

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

Large-aperture low-loss fibre-optic Raman amplifier of 1.3 μm signals with 30 dB gain

1995 ◽  
Vol 25 (7) ◽  
pp. 615-616
Author(s):  
Evgenii M Dianov ◽  
A A Abramov ◽  
M M Bubnov ◽  
A M Prokhorov ◽  
A V Shipulin ◽  
...  
Keyword(s):  
Fibre Optic ◽  
Low Loss ◽  
Raman Amplifier ◽  
Large Aperture
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