Low-Loss Glass Substrates Formulated with a Variety of Dielectric Characteristics for Millimeter-Wave Applications

2019 ◽  
Author(s):  
Kazutaka Hayashi ◽  
Nobutaka Kidera ◽  
Yoichiro Sato
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
Dielectric Characteristics ◽  
Glass Substrates

Low-Loss 3D-Coplanar Line Structure for Millimeter Wave Applications Using Laser Direct Structuring Technology

2021 ◽  
Author(s):  
S. Seewald ◽  
D. Manteuffel ◽  
M. Wolf ◽  
M. Barth ◽  
W. Eberhardt ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
Coplanar Line ◽  
Line Structure

A low-loss compact stripline low-pass filter for millimeter-wave applications

2016 ◽  
Author(s):  
A. Gomez-Torrent ◽  
I. Arregui ◽  
J.D. Martinez ◽  
F. Teberio ◽  
J. V. M. Sanchez de Rojas ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Low Loss ◽  
Pass Filter ◽  
Low Pass Filter ◽  
Low Pass

Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris
Keyword(s):  
3D Printing ◽  
Millimeter Wave ◽  
Integrated Circuit ◽  
Coplanar Waveguide ◽  
Frequency Selective Surface ◽  
60 Ghz ◽  
Low Loss ◽  
Printing Technology ◽  
3D Printing Technology ◽  
Application Specific

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.

Microwave Dielectric Characteristics of BaO-Nd2O3-TiO2 Nano-Particles by Millimeter-Wave Sintering

2007 ◽  
Vol 280-283 ◽  
pp. 31-34 ◽  
Author(s):  
Yong Xiang ◽  
Dao Hua Xie ◽  
Yu Shuang Zhao ◽  
Yi Long Su ◽  
Ji Run Luo
Keyword(s):  
Millimeter Wave ◽  
Layer Structure ◽  
Tungsten Bronze ◽  
Secondary Phase ◽  
Nano Particles ◽  
Very High Frequency ◽  
Dielectric Characteristics ◽  
Low Dielectric ◽  
Fine Grain ◽  
Microwave Dielectric

By means of 34.5 GHz millimeter-wave (MMW) sintering, BaO-Nd2O3-TiO2 microwave ceramic dielectric was prepared from nano-particles of the xBaO×(0.35-x)Nd2O3×0.65TiO2 ternary compound, which possess fine grain, low porosity and good dielectric characteristics. The materials which have ultra-low dielectric loss can be fired by MMW heating at very high frequency, which is unable to be done by normal microwave heating at 2.45 GHz. The sintering temperature is 160 ~ 400°C lower than that of normal firing. The ceramic sample consists of the main phase of Nd2Ti2O7 with perovskite-like layer structure (PLS) and the secondary phase of BaNd2Ti4O12 (Ba4.5Nd9Ti18O54)with perovskite-like tungsten bronze structure, being the same as the results from normal sintering. The excellent microwave characteristics were observed.

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