Advanced COPNA-resin as a low temperature curing resin for high-density electronic packages
1996 ◽
Vol 19
(3)
◽
pp. 585-592
◽
Keyword(s):
2004 ◽
Vol 73-74
◽
pp. 452-455
◽
Keyword(s):
2001 ◽
Vol 48
(8)
◽
pp. 1550-1555
◽
Keyword(s):
Keyword(s):