Single-phase and boiling cooling of small pin fin arrays by multiple slot nozzle suction and impingement

Author(s):  
D. Copeland
1996 ◽  
Vol 118 (1) ◽  
pp. 21-26 ◽  
Author(s):  
David Copeland

Experimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width and spacing of 0.1 and 0.2 mm, with aspect ratios from 1 to 5. Arrays of 25 and 100 nozzles were used, with diameters of 0.25 to 1.0 mm providing nozzle area from 5 to 20 mm2 (5 to 20% of the heat source base area). Flow rates of 2.5 to 10 cm3/s (0.15 to 0.6 l/min) were studied, with nozzle velocities from 0.125 to 2 m/s. Single nozzles and smooth surfaces were also evaluated for comparison. Single-phase heat transfer coefficients (based on planform area) from 2.4 to 49.3 kW/m2 K were measured, while critical heat flux varied from 45 to 395 W/cm2. Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of pin fin dimensions, number of nozzles, nozzle area and liquid flow rate are provided.


2008 ◽  
Vol 130 (12) ◽  
Author(s):  
Weilin Qu ◽  
Abel Siu-Ho

This Technical Brief is Part II of a two-part study concerning water single-phase pressure drop and heat transfer in an array of staggered micro-pin-fins. This brief reports the pressure drop results. Both adiabatic and diabatic tests were conducted. Six previous friction factor correlations for low Reynolds number (Re<1000) flow in conventional and micro-pin-fin arrays were examined and found underpredicting the adiabatic data except the correlation by Short et al. (2002, “Performance of Pin Fin Cast Aluminum Coldwalls, Part 1: Friction Factor Correlation,” J. Thermophys. Heat Transfer, 16(3), pp. 389–396), which overpredicts the data. A new power-law type of correlation was developed, which showed good agreement with both adiabatic and diabatic data.


Author(s):  
Zhuo Cui

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.


2017 ◽  
Vol 140 (3) ◽  
Author(s):  
Fayao Xu ◽  
Huiying Wu ◽  
Zhenyu Liu

In this paper, the flow patterns during water flow boiling instability in pin-fin microchannels were experimentally studied. Three types of pin-fin arrays (in-line/circular pin-fins, staggered/circular pin-fins, and staggered/square pin-fins) were used in the study. The flow instability started to occur as the outlet water reached the saturation temperature. Before the unstable boiling, a wider range of stable boiling existed in the pin-fin microchannels compared to that in the plain microchannels. Two flow instability modes for the temperature and pressure oscillations, which were long-period/large-amplitude mode and short-period/small-amplitude mode, were identified. The temperature variation during the oscillation period of the long-period/large-amplitude mode can be divided into two stages: increasing stage and decreasing stage. In the increasing stage, bubbly flow, vapor-slug flow, stratified flow, and wispy flow occurred sequentially with time for the in-line pin-fin microchannels; liquid single-phase flow, aforementioned four kinds of two-phase flow patterns, and vapor single-phase flow occurred sequentially with time for the staggered pin-fin microchannel. The flow pattern transitions in the decreasing stage were the inverse of those in the increasing stage for both in-line and staggered pin-fin microchannels. For the short-period/small-amplitude oscillation mode, only the wispy flow occurred. With the increase of heat flux, the wispy flow and the vapor single-phase flow occupied more and more time ratio during an oscillation period in the in-line and staggered pin-fin microchannels.


Author(s):  
F. E. Ames ◽  
L. A. Dvorak

The objective of this research has been to experimentally investigate the fluid dynamics of pin fin arrays in order to clarify the physics of heat transfer enhancement and uncover problems in conventional turbulence models. The fluid dynamics of a staggered pin fin array have been studied using hot wire anemometry with both single and x-wire probes at array Reynolds numbers of 3000; 10,000; and 30,000. Velocity distributions off the endwall and pin surface have been acquired and analyzed to investigate turbulent transport in pin fin arrays. Well resolved 3-D calculations have been performed using a commercial code with conventional two-equation turbulence models. Predictive comparisons have been made with fluid dynamic data. In early rows where turbulence is low, the strength of shedding increases dramatically with increasing in Reynolds numbers. The laminar velocity profiles off the surface of pins show evidence of unsteady separation in early rows. In row three and beyond laminar boundary layers off pins are quite similar. Velocity profiles off endwalls are strongly affected by the proximity of pins and turbulent transport. At the low Reynolds numbers, the turbulent transport and acceleration keep boundary layers thin. Endwall boundary layers at higher Reynolds numbers exhibit very high levels of skin friction enhancement. Well resolved 3-D steady calculations were made with several two-equation turbulence models and compared with experimental fluid mechanic and heat transfer data. The quality of the predictive comparison was substantially affected by the turbulence model and near wall methodology.


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