On the modeling of metal strip antennas contiguous with the edge of electrically thick finite size dielectric substrates

1992 ◽  
Vol 40 (2) ◽  
pp. 134-140 ◽  
Author(s):  
A.J. Parfitt ◽  
D.W. Griffin ◽  
P.H. Cole
Keyword(s):  
Finite Size ◽  
Metal Strip ◽  
Dielectric Substrates

The partial realization theory of finite size two-dimensional arrays

1981 ◽  
Vol 64 (10) ◽  
pp. 1-8
Author(s):  
Tsuyoshi Matsuo ◽  
Yasumichi Hasegawa ◽  
Yoshikuni Okada
Keyword(s):  
Finite Size ◽  
Two Dimensional ◽  
Realization Theory

Electrical Anisotropy of Thin Metal Films Growing on Dielectric Substrates

2002 ◽  
Vol 7 (2) ◽  
pp. 45-52
Author(s):  
L. Jakučionis ◽  
V. Kleiza
Keyword(s):  
Magnetic Field ◽  
Thin Films ◽  
Uniaxial Anisotropy ◽  
Metal Films ◽  
Thin Layers ◽  
Electrical Anisotropy ◽  
Electrical Field ◽  
Dielectric Substrates ◽  
Unequal Probability ◽  
Conductive Thin Films

Electrical properties of conductive thin films, that are produced by vacuum evaporation on the dielectric substrates, and which properties depend on their thickness, usually are anisotropic i.e. they have uniaxial anisotropy. If the condensate grow on dielectric substrates on which plane electrical field E is created the transverse voltage U⊥ appears on the boundary of the film in the direction perpendicular to E. Transverse voltage U⊥ depends on the angle γ between the applied magnetic field H and axis of light magnetisation. When electric field E is applied to continuous or grid layers, U⊥ and resistance R of layers are changed by changing γ. It means that value of U⊥ is the measure of anisotropy magnitude. Increasing voltage U0 , which is created by E, U⊥ increases to certain magnitude and later decreases. The anisotropy of continuous thin layers is excited by inequality of conductivity tensor components σ0 ≠ σ⊥. The reason of anisotropy is explained by the model which shows that properties of grain boundaries are defined by unequal probability of transient of charge carrier.

SOMERS LTA COPPER

Alloy Digest ◽  
1980 ◽  
Vol 29 (12) ◽  
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Physical Properties ◽  
Copper Foil ◽  
Heat Treating ◽  
Dielectric Substrates ◽  
Printed Circuits

Abstract SOMERS LTA Copper is a wrought copper foil that can be annealed at 350 F in 15 minutes to the full-soft condition; its use simplifies the manufacture of printed circuits (LTA = Low-Temperature Annealable). LTA Copper is especially useful for foil weights up to and including one ounce per square foot (0.0014-inch thick) for laminating to high-temperature dielectric substrates. This datasheet provides information on composition, physical properties, and elasticity as well as fatigue. It also includes information on forming, heat treating, and machining. Filing Code: Cu-407. Producer or source: Olin Corporation.

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