Surface resistance of screen-printed Bi2223 thick films on Ag and dielectric ceramic substrates

1999 ◽  
Vol 9 (2) ◽  
pp. 1940-1943 ◽  
Author(s):  
T. Tatekawa ◽  
N. Matsui ◽  
Y. Kintaka ◽  
Y. Ishikawa ◽  
K. Fujikawa ◽  
...  
1989 ◽  
pp. 451-459
Author(s):  
J. LEVOSKA ◽  
A. UUSIMÄKI ◽  
J. HAGBERG ◽  
T. KOKKOMÄKI ◽  
T. MURTONIEMI ◽  
...  

1989 ◽  
Vol 151 ◽  
pp. 451-459 ◽  
Author(s):  
J Levoska ◽  
A Uusimäki ◽  
J Hagberg ◽  
T Kokkomäki ◽  
T Murtoniemi ◽  
...  

1991 ◽  
Vol 14 (3) ◽  
pp. 175-179
Author(s):  
Maurizio Sacchi ◽  
Fausto Sirotti ◽  
Bruno Morten ◽  
Maria Prudenziati

We have prepared screen-printed films of the Y-Ba-Cu-O compound starting from a spray-pyrolysis precursor powder. BeO ceramic substrates are confirmed to be inert with respect to the film up to about 1000ºC. Electrical properties of oxygen annealed films are investigated, evidencing excellent superconducting behaviour, both in terms ofTc(≃91K)and Jc(>102A.cm-2at 77 K).


2002 ◽  
Author(s):  
M.R. Parikh ◽  
W.F. Quilty ◽  
K.M. Gardiner
Keyword(s):  

1990 ◽  
Vol 29 (Part 2, No. 7) ◽  
pp. L1075-L1078 ◽  
Author(s):  
Osamu Ishii ◽  
Tsuneo Konaka ◽  
Makoto Sato ◽  
Yasuhiro Koshimoto

1989 ◽  
Vol 97 (1130) ◽  
pp. 1053-1057 ◽  
Author(s):  
Hidenao MATUSHIMA ◽  
Masami KOSHIMURA ◽  
Tamotsu UEYAMA ◽  
Mikiya ONO ◽  
Takashi YAMAMOTO

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Piotr Kowalik ◽  
Edyta Wróbel

Purpose This paper aims to present the possibility of computer-aided technology of chemical metallization for the production of electrodes and resistors based on Ni-P and Ni-Cu-P layers. Design/methodology/approach Based on the calculated parameters of the process, test structures were made on an alumina substrate using the selective metallization method. Dependences of the surface resistance on the metallization time were made. These dependencies take into account the comparison of the calculations with the performed experiment. Findings The author created a convenient and easy-to-use tool for calculating basic Ni-P and Ni-Cu-P layer parameters, namely, surface resistance and temperature coefficient of resistance (TCR) of test resistor, based on chemical metallization parameters. The values are calculated for a given level of surface resistance of Ni-P and Ni-Cu-P layer and defined required range of changes of TCR of test resistor. The calculations are possible for surface resistance values in the range of 0.4 Ohm/square ÷ 2.5 Ohm/square. As a result of the experiment, surface resistances were obtained that practically coincide with the calculations made with the use of the program created by the authors. The quality of the structures made is very good. Originality/value To the best of the authors’ knowledge, the paper presents a new, unpublished method of manufacturing electrodes (resistors) on silicon, Al2O3 and low temperature co-fired ceramic substrates based on the authors developed computer program.


2000 ◽  
Vol 30 (1-4) ◽  
pp. 91-101 ◽  
Author(s):  
Yongbae Jeon ◽  
Yong Gyo Seo ◽  
Seong-jin Kim ◽  
Kwangsoo No

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