scholarly journals Microstructural characterization of Ag-sheathed Tl-Ba-Ca-Cu-O and Bi-Sr-Ca-Cu-O superconducting tapes by analytical electron microscopy

1993 ◽  
Vol 3 (1) ◽  
pp. 1215-1218 ◽  
Author(s):  
J.G. Hu ◽  
D.J. Miller ◽  
K.C. Goretta ◽  
R.B. Poeppel
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Microstructural Characterization ◽  
Superconducting Tapes ◽  
Analytical Electron

scholarly journals Microstructural characterization of the tool–chip interface enabled by focused ion beam and analytical electron microscopy

Wear ◽  
2009 ◽  
Vol 266 (11-12) ◽  
pp. 1237-1240 ◽  
Author(s):  
A. Flink ◽  
R. M'Saoubi ◽  
F. Giuliani ◽  
J. Sjölén ◽  
T. Larsson ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Analytical Electron Microscopy ◽  
Microstructural Characterization ◽  
Analytical Electron

AEM Study of thin and Thick Film Metallization on AIN Substrates

1987 ◽  
Vol 108 ◽  
Author(s):  
Alistair D. Westwood ◽  
Michael R. Notis
Keyword(s):  
Electron Microscopy ◽  
Thick Film ◽  
Analytical Electron Microscopy ◽  
Microstructural Characterization ◽  
Convergent Beam Electron Diffraction ◽  
Transmission Electron ◽  
Analytical Electron ◽  
Convergent Beam ◽  
Boundary Penetration

ABSTRACTMicrostructural characterization of thin film (Au-Pt-Ti) and thick film (Mo-Mn) metallization on AIN substrates has been performed using Transmission Electron Microscopy (TEM), Analytical Electron Microscopy (AEM), Convergent Beam Electron Diffraction (CBED) and Auger Electron Spectroscopy (AES). The reaction mechanisms for both types of metallization methods are proposed. In particular, the microchemical and morphological nature of grain boundary penetration and precipitation within the AIN near the metallization interface has been examined.

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