A fully integrated high-performance FM stereo decoder

1992 ◽  
Vol 27 (3) ◽  
pp. 343-350 ◽  
Author(s):  
G.J. Manlove ◽  
J.J. Marrah ◽  
R.A. Kennedy
Keyword(s):  
High Performance ◽  
Fully Integrated

Fully Integrated Organic Nanocrystal Diode as High Performance Room Temperature NO2Sensor

2016 ◽  
Vol 28 (15) ◽  
pp. 2971-2977 ◽  
Author(s):  
Abdur Rehman Jalil ◽  
Hao Chang ◽  
Vineeth Kumar Bandari ◽  
Peter Robaschik ◽  
Jian Zhang ◽  
...  
Keyword(s):  
High Performance ◽  
Room Temperature ◽  
Fully Integrated

Fully-integrated multifunctional fast time to amplitude converter for high-performance timing applications

2021 ◽  
Author(s):  
Giulia Acconcia ◽  
Francesco Malanga ◽  
Ivan Labanca ◽  
Massimo Ghioni ◽  
Ivan Rech
Keyword(s):  
High Performance ◽  
Fast Time ◽  
Fully Integrated ◽  
Performance Timing

Package Voltage Regulators: The Answer for Power Management Challenges

2019 ◽  
Vol 2019 (1) ◽  
pp. 000438-000443 ◽  
Author(s):  
Joseph Meyer ◽  
Reza Moghimi ◽  
Noah Sturcken
Keyword(s):  
Integrated Circuit ◽  
High Performance ◽  
Power Conversion ◽  
Cmos Technology ◽  
Voltage Regulation ◽  
Voltage Regulators ◽  
Electronic Systems ◽  
Single Chip ◽  
Fully Integrated ◽  
Computational Performance

Abstract The generational scaling of CMOS device geometries, as predicted by Moore's law, has significantly outpaced advances in CMOS package and power electronics technology. The conduction of power to a high-performance integrated circuit (IC) die typically requires close to 50% of package and IC I/O and is increasing with trends towards lower supply voltages and higher power density that occur in advanced CMOS nodes. The disparity in scaling of logic, package, and I/O technology has created a significant bottleneck that has become a dominant constraint on computational performance. By performing power conversion and voltage regulation in-package, this limitation can be mitigated. Integration of thin-film ferromagnetic inductors with CMOS technology enables single-chip power converters to be co-packaged with processors, high bandwidth memory (HBM), and/or other modules. This paper highlights the advantages of fully integrated package voltage regulators (PVRs), which include: reducing package I/O allocated for power, eliminating the need for upstream power-conversion stages, and improving transient response. These benefits substantially reduce the size, weight, and power of modern electronic systems.

High-Performance MEMS Pressure Sensor Fully-Integrated with a 3-Axis Accelerometer

2019 ◽  
Author(s):  
Frederic Souchon ◽  
Loic Joet ◽  
Carine Ladner ◽  
Patrice Rey ◽  
Stephan Louwers
Keyword(s):  
Pressure Sensor ◽  
High Performance ◽  
Fully Integrated

Fully integrated, high performance triple SD PLL (2.2Ghz to 4.4Ghz) with minimized interaction

2008 ◽  
Author(s):  
Stefano Cipriani ◽  
Eric Duvivier ◽  
Gianni Puccio ◽  
Lorenzo Carpineto ◽  
Biagio Bisanti ◽  
...  
Keyword(s):  
High Performance ◽  
Fully Integrated

Design model for fully integrated high-performance linear CMOS power amplifiers

2011 ◽  
Vol 5 (7) ◽  
pp. 795
Author(s):  
H. Solar ◽  
G. Bistué ◽  
J. Legarda ◽  
E. Fernández ◽  
R. Berenguer
Keyword(s):  
Power Amplifiers ◽  
High Performance ◽  
Design Model ◽  
Fully Integrated

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics

2009 ◽  
Author(s):  
Ihtesham Chowdhury ◽  
Ravi Prasher ◽  
Kelly Lofgreen ◽  
Sridhar Narasimhan ◽  
Ravi Mahajan ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Flux ◽  
Thermal Management ◽  
High Performance ◽  
High Heat ◽  
Thermoelectric Device ◽  
High Heat Flux ◽  
General Will ◽  
Site Specific ◽  
Fully Integrated

We have recently reported the first ever demonstration of active cooling of hot-spots of >1 kW/cm2 in a packaged electronic chip using thin-film superlattice thermoelectric cooler (TEC) cooling technology [1]. In this paper, we provide a detailed account of both experimental and theoretical aspects of this technological demonstration and progress. We have achieved cooling of as much as 15°C at a location on the chip where the heat-flux is as high as ∼1300 W/cm2, with the help of a thin-film TEC integrated into the package. To our knowledge, this is the first demonstration of high heat-flux cooling with a thin-film thermoelectric device made from superlattices when it is fully integrated into a usable electronic package. Our results, which validate the concept of site-specific micro-scale cooling of electronics in general, will have significant potential for thermal management of future generations of microprocessors. Similar active thermal management could also be relevant for high-performance solid-state lasers and power electronic chips.

scholarly journals Automatic Phenotyping of Tomatoes in Production Greenhouses Using Robotics and Computer Vision: From Theory to Practice

Agronomy ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1599
Author(s):  
Hubert Fonteijn ◽  
Manya Afonso ◽  
Dick Lensink ◽  
Marcel Mooij ◽  
Nanne Faber ◽  
...  
Keyword(s):  
High Performance ◽  
Production Environment ◽  
Fully Integrated ◽  
System A ◽  
Challenging Environment ◽  
Spatial Reference Frame ◽  
High Throughput Phenotyping ◽  
Genetic Value ◽  
Automatic Phenotyping ◽  
Non Destructive

High-throughput phenotyping is playing an increasingly important role in many areas of agriculture. Breeders will use it to obtain values for the traits of interest so that they can estimate genetic value and select promising varieties; growers may be interested in having predictions of yield well in advance of the actual harvest. In most phenotyping applications, image analysis plays an important role, drastically reducing the dependence on manual labor while being non-destructive. An automatic phenotyping system combines a reliable acquisition system, a high-performance segmentation algorithm for detecting fruits in individual images, and a registration algorithm that brings the images (and the corresponding detected plants or plant components) into a coherent spatial reference frame. Recently, significant advances have been made in the fields of robotics, image registration, and especially image segmentation, which each individually have improved the prospect of developing a fully integrated automatic phenotyping system. However, so far no complete phenotyping systems have been reported for routine use in a production environment. This work catalogs the outstanding issues that remain to be resolved by describing a prototype phenotyping system for a production tomato greenhouse, for many reasons a challenging environment.

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