A fracture mechanics approach to thermal fatigue life prediction of solder joints

Y.-H. Pao

doi:10.1109/33.159886

A fracture mechanics approach to thermal fatigue life prediction of solder joints

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.159886 ◽

1992 ◽

Vol 15 (4) ◽

pp. 559-570 ◽

Cited By ~ 65

Author(s):

Y.-H. Pao

Keyword(s):

Fatigue Life ◽

Fracture Mechanics ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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Thermal fatigue life prediction of flip chip solder joints by fracture mechanics method

Engineering Fracture Mechanics ◽

10.1016/0013-7944(93)90270-3 ◽

1993 ◽

Vol 45 (5) ◽

pp. 643-654 ◽

Cited By ~ 30

Author(s):

John H. Lau

Keyword(s):

Fatigue Life ◽

Fracture Mechanics ◽

Thermal Fatigue ◽

Life Prediction ◽

Flip Chip ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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A fracture mechanics approach to thermal fatigue life prediction of solder joints

Microelectronics Reliability ◽

10.1016/0026-2714(93)90379-d ◽

1993 ◽

Vol 33 (13) ◽

pp. 2057

Keyword(s):

Fatigue Life ◽

Fracture Mechanics ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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Effects of microstructure on thermal fatigue life prediction of solder joints

2012 14th International Conference on Electronic Materials and Packaging (EMAP) ◽

10.1109/emap.2012.6507879 ◽

2012 ◽

Author(s):

Hiue Tran ◽

Yin Fun Chua ◽

Sung Yi ◽

Phil Geng

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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Thermal fatigue life prediction for solder joints with the consideration of damage evolution

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) ◽

10.1109/eptc.1998.756016 ◽

2002 ◽

Author(s):

X. Zhang ◽

S.-W.R. Lee

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Damage Evolution ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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Thermal fatigue life prediction of solder joints of plastic ball grid array packages

International Journal of Materials and Structural Integrity ◽

10.1504/ijmsi.2014.064769 ◽

2014 ◽

Vol 8 (1/2/3) ◽

pp. 3 ◽

Cited By ~ 1

Author(s):

Yin Fun Chu ◽

Sung Yi ◽

Phil Geng

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Ball Grid Array ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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Process capability study and thermal fatigue life prediction of ceramic BGA solder joints

Finite Elements in Analysis and Design ◽

10.1016/s0168-874x(98)00032-8 ◽

1998 ◽

Vol 30 (1-2) ◽

pp. 31-45 ◽

Cited By ~ 10

Author(s):

D.J Xie ◽

Z.P Wang

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Process Capability ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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Experimental Study on Thermal Fatigue Life Prediction Model of PBGA Solder Joints

2019 Prognostics and System Health Management Conference (PHM-Qingdao) ◽

10.1109/phm-qingdao46334.2019.8942918 ◽

2019 ◽

Author(s):

Jiang Shao

Keyword(s):

Experimental Study ◽

Fatigue Life ◽

Prediction Model ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life ◽

Life Prediction Model

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A new design-for-reliability approach to thermal fatigue life prediction of leadless solder joints

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581276 ◽

1997 ◽

Author(s):

Y.-H. Pao ◽

E. Jih ◽

R. Liu ◽

V. Siddapureddy ◽

X. Song ◽

...

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Design For Reliability ◽

Thermal Fatigue Life

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Reliability and thermal fatigue life prediction of solder joints for advanced automotive microelectronics

Journal of Mechanical Science and Technology ◽

10.1007/s12206-021-0734-6 ◽

2021 ◽

Author(s):

Jiachen Gao ◽

Jae B. Kwak

Keyword(s):

Fatigue Life ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life

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Thermal Fatigue Life Prediction of BGA Solder Joints Using a Creep Constitutive Equation Incorporating Microstructural Coarsening Effect

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.mt-m2020313 ◽

2021 ◽

Vol 62 (2) ◽

pp. 205-212

Author(s):

Kouichi Morooka ◽

Yoshiharu Kariya

Keyword(s):

Fatigue Life ◽

Constitutive Equation ◽

Thermal Fatigue ◽

Life Prediction ◽

Solder Joints ◽

Fatigue Life Prediction ◽

Thermal Fatigue Life ◽

Microstructural Coarsening

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