Direct wafer bonding of III-V compound semiconductors for free-material and free-orientation integration

1997 ◽  
Vol 33 (6) ◽  
pp. 959-969 ◽  
Author(s):  
Y. Okuno ◽  
K. Uomi ◽  
M. Aoki ◽  
T. Tsuchiya
Keyword(s):  
Wafer Bonding ◽  
Compound Semiconductors ◽  
Direct Wafer Bonding ◽  
Free Material

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Low temperature GaAs/Si direct wafer bonding

2000 ◽  
Vol 36 (7) ◽  
pp. 677 ◽  
Author(s):  
M. Alexe ◽  
V. Dragoi ◽  
M. Reiche ◽  
U. Gösele
Keyword(s):  
Low Temperature ◽  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Low Temperature Gaas

Point defects generated by direct-wafer bonding of silicon

2002 ◽  
Vol 31 (2) ◽  
pp. 113-118 ◽  
Author(s):  
L. Dózsa ◽  
B. Szentpáli ◽  
D. Pasquariello ◽  
K. Hjort
Keyword(s):  
Point Defects ◽  
Wafer Bonding ◽  
Direct Wafer Bonding

New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers

2019 ◽  
Vol 3 (6) ◽  
pp. 79-90 ◽  
Author(s):  
Bernard Aspar ◽  
Chrystelle Lagahe-Blanchard ◽  
Nicolas Sousbie ◽  
Jacques Margail ◽  
H. Moriceau
Keyword(s):  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
New Generation

Pb(Zr,Ti)O3-silicon heterostructures fabricated by direct wafer bonding

1998 ◽  
Vol 19 (1-4) ◽  
pp. 95-109 ◽  
Author(s):  
Marin Alexe ◽  
James F. Scott ◽  
Alain Pignolet ◽  
Dietrich Hesse ◽  
Ulrich Gösele
Keyword(s):  
Wafer Bonding ◽  
Direct Wafer Bonding ◽  
Silicon Heterostructures

(Invited) Water Transport Along Si/Si Direct Wafer Bonding Interfaces

2018 ◽  
Vol 86 (5) ◽  
pp. 39-47
Author(s):  
François Rieutord ◽  
Samuel Tardif ◽  
Ivan Nikitskiy ◽  
Frank Fournel ◽  
Marwan Tedjini ◽  
...  
Keyword(s):  
Water Transport ◽  
Wafer Bonding ◽  
Direct Wafer Bonding
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