Millimeter-wave monolithic integrated circuit characterization by a picosecond optoelectronic technique

1989 ◽  
Vol 37 (8) ◽  
pp. 1223-1231 ◽  
Author(s):  
H.-L.A. Hung ◽  
P. Polak-Dingels ◽  
K.J. Webb ◽  
T. Smith ◽  
H.C. Huang ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Integrated Circuit ◽  
Monolithic Integrated Circuit

A Hybrid Antenna in Package Solution Using FOWLP Technology

2021 ◽  
Author(s):  
XueSong Zhang ◽  
Qian Wang ◽  
Bo Wang ◽  
Gang Wang ◽  
Xin Gu ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Transmission Loss ◽  
Rapid Development ◽  
Coplanar Waveguide ◽  
Organic Substrate ◽  
Hybrid Integration ◽  
Wafer Level ◽  
Monolithic Integrated Circuit

Abstract Widespread millimeter wave applications have promoted rapid development of System in Package (SiP) and Antenna in Package (AiP). Most AiP structures take the form of flip chip on antenna substrate, where interconnect losses are caused by solder bumps, and manufacturing difficulties may be encountered for chips with fine pad pitches. Fan-out wafer level package (FOWLP) with antenna patterning on Redistributed Layers (RDL) is another method for mm-wave AiP realization. In this project a hybrid integration AiP structure is developed. The Microwave Monolithic Integrated Circuit (MMIC) chip and antenna unit are integrated with chip-first FOWLP process. By using multilayer organic substrate and fine pitch RDL interconnection, proper antenna performance and lower transmission loss can be achieved. Modified coplanar waveguide is adopted to feed 2x2 aperture array formed on RDL. Package warpage is evaluated using ANSYS and Shadow Moire measurement. The antenna realizes bandwidth 25% and gain 8.5dBi using aperture-coupled stacked patch for 60GHz digital communication system. The proposed approach is a convenient solution for the hybrid integration of millimeter wave AiP systems.

scholarly journals Metamaterial CRLH Antennas on Silicon Substrate for Millimeter-Wave Integrated Circuits

2012 ◽  
Vol 2012 ◽  
pp. 1-9 ◽  
Author(s):  
Gheorghe Ioan Sajin ◽  
Iulia Andreea Mocanu
Keyword(s):  
Integrated Circuits ◽  
Millimeter Wave ◽  
Integrated Circuit ◽  
Silicon Substrate ◽  
Return Loss ◽  
Coplanar Waveguide ◽  
Radiation Characteristic ◽  
Millimetric Wave ◽  
Monolithic Integrated Circuit ◽  
Left Handed

The paper presents two composite right/left-handed (CRLH) coplanar waveguide (CPW) zeroth-order resonant (ZOR) antennas which were designed, processed, and electrically characterized for applications in the millimetric wave frequency range. Two CRLH antennas were developed forf=27 GHz andf=38.5, GHz, respectively. The CRLH antenna onf=27 GHz shows a return loss ofRL<−18.78 dB atf=26.88 GHz. The −3 dB radiation characteristic beamwidth was approximately 37° and the gain wasGi=2.82 dBi. The CRLH antenna onf=38.5 GHz has a return loss ofRL<−38.5 dB atf=38.82 GHz and the −3 dB radiation characteristic beamwidth of approximately 17°. The gains wereGi=1.08 dBi atf=38 GHz andGi=1.2 dBi atf=38.6 GHz. The maximum measured gain wasGi=1.75 dBi atf=38.2 GHz. It is, upon the authors' knowledge, the first report of millimeter wave CRLH antennas on silicon substrate in CPW technique for use in mm-wave monolithic integrated circuit.

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