Effect of seed layer on the magnetoresistance characteristics in a-CoNbZr-based spin valves

1998 ◽  
Vol 34 (4) ◽  
pp. 1414-1416 ◽  
Author(s):  
Hae Seok Cho ◽  
F. Ueda ◽  
Chunghong Hou ◽  
H. Fujiwara
Keyword(s):  
Seed Layer ◽  
Spin Valves

Improved interfaces and magnetic properties in spin valves using Ni80Fe20 seed layer

2002 ◽  
Vol 91 (6) ◽  
pp. 3891-3895 ◽  
Author(s):  
Edward J. Repetski ◽  
David X. Yang ◽  
Harsh Deep Chopra ◽  
P. J. Chen ◽  
W. F. Egelhoff
Keyword(s):  
Magnetic Properties ◽  
Seed Layer ◽  
Spin Valves

Seed layer characterization for PtMn bottom spin-filter spin valves

2003 ◽  
Vol 93 (10) ◽  
pp. 8406-8408 ◽  
Author(s):  
Chih-Ling Lee ◽  
Adrian Devasahayam ◽  
Ming Mao ◽  
Jacques Kools ◽  
Paty Cox ◽  
...  
Keyword(s):  
Seed Layer ◽  
Spin Valves ◽  
Spin Filter

Effects of Ta seed layer and annealing on magnetoresistance in CoFe∕Pd-based pseudo-spin-valves with perpendicular anisotropy

2007 ◽  
Vol 91 (24) ◽  
pp. 242504 ◽  
Author(s):  
Randall Law ◽  
Rachid Sbiaa ◽  
Thomas Liew ◽  
Tow Chong Chong
Keyword(s):  
Seed Layer ◽  
Spin Valves ◽  
Perpendicular Anisotropy

scholarly journals Thickness optimization of underlayer and seed layer for spin valves

2009 ◽  
Vol 65 (a1) ◽  
pp. s208-s208
Author(s):  
Hakan Cinar ◽  
R. Mustafa Oksuzoglu ◽  
Mustafa Yildirim
Keyword(s):  
Seed Layer ◽  
Spin Valves ◽  
Thickness Optimization

Study of Nucleation of Electroless Cu Deposition on Pd

1996 ◽  
Vol 451 ◽  
Author(s):  
R. Amster ◽  
B. Johnson ◽  
L. S. Vanasupa
Keyword(s):  
Seed Layer ◽  
Si Substrate

ABSTRACTWe studied the nucleation of Cu deposited by an electroless bath. A Pd seed layer was sputtered onto a (100) Si substrate and analyzed with GIX, STM, and AFM. The seed layer was then placed in varying ED-Cu bath conditions and also analyzed using GIX, STM, and AFM. GIX analysis results show a (111) texture for the Pd seed layer as well as the ED-Cu layer. The seed layer's influence on the deposited Cu grain's texture was found to be inconclusive.

The Novel TEM Sample Preparation Approach for Targeted via with Barrier/Cu Seed Layer Inspection

2009 ◽  
Author(s):  
Wen-Fei Hsieh ◽  
Shih-Hsiang Tseng ◽  
Bo Min She
Keyword(s):  
Sample Preparation ◽  
Cross Section ◽  
Seed Layer ◽  
Target Location ◽  
Process Development ◽  
Process Integration ◽  
Ion Beam ◽  
Main Tool ◽  
Dual Beam ◽  
Sample Preparation Procedure

Abstract In this study, an FIB-based cross section TEM sample preparation procedure for targeted via with barrier/Cu seed layer is introduced. The dual beam FIB with electron beam for target location and Ga ion beam for sample milling is the main tool for the targeted via with barrier/Cu seed layer inspection. With the help of the FIB operation and epoxy layer protection, ta cross section TEM sample at a targeted via with barrier/Cu seed layer could be made. Subsequent TEM inspection is used to verify the quality of the structure. This approach was used in the Cu process integration performance monitor. All these TEM results are very helpful in process development and yield improvement.

Spin transfer effects in current perpendicular to the plane spin valves

2005 ◽  
Vol 287 ◽  
pp. 325-332 ◽  
Author(s):  
M. Covington ◽  
M. AlHajDarwish ◽  
Y. Ding ◽  
A. Rebei ◽  
G.J. Parker ◽  
...  
Keyword(s):  
Spin Transfer ◽  
Spin Valves ◽  
Transfer Effects
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