Monolithic integration of a 94 GHz AlGaAs/GaAs 2-DEG mixer on quartz substrate by epitaxial lift-off

R. Basco; A. Prabhu; S. Yngvesson;  Kei May Lau

doi:10.1109/16.554785

Monolithic integration of a 94 GHz AlGaAs/GaAs 2-DEG mixer on quartz substrate by epitaxial lift-off

IEEE Transactions on Electron Devices ◽

10.1109/16.554785 ◽

1997 ◽

Vol 44 (1) ◽

pp. 11-16 ◽

Cited By ~ 8

Author(s):

R. Basco ◽

A. Prabhu ◽

S. Yngvesson ◽

Kei May Lau

Keyword(s):

Quartz Substrate ◽

Monolithic Integration ◽

Lift Off

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Monolithic integration of a 94 GHz AlGaAs/GaAs 2DEG mixer on quartz substrate by epitaxial lift-off

1995 53rd Annual Device Research Conference Digest ◽

10.1109/drc.1995.496240 ◽

2002 ◽

Author(s):

R. Basco ◽

A. Prabhu ◽

S. Yngvesson ◽

Kei May Lau

Keyword(s):

Quartz Substrate ◽

Monolithic Integration ◽

Lift Off

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Erratum: Monolithic integration of an InGaAs/GaAs/AlGaAs strained layer SQW LED and GaAs MESFET using epitaxial lift-off

Electronics Letters ◽

10.1049/el:19900852 ◽

1990 ◽

Vol 26 (16) ◽

pp. 1324

Author(s):

I. Pollentier ◽

L. Buydens ◽

A. Ackaert ◽

P. Demeester ◽

P. van Daele ◽

...

Keyword(s):

Monolithic Integration ◽

Strained Layer ◽

Gaas Mesfet ◽

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Development of a Transparent Heater to Measure Surface Temperature Fluctuations Under Spray Cooling Conditions

Journal of Heat Transfer ◽

10.1115/1.2952761 ◽

2008 ◽

Vol 130 (11) ◽

Cited By ~ 6

Author(s):

A. R. Griffin ◽

A. Vijayakumar ◽

R.-H. Chen ◽

K. B. Sundaram ◽

L. C. Chow

Keyword(s):

Surface Temperature ◽

Indium Tin Oxide ◽

High Speed ◽

Quartz Substrate ◽

Sampling Rate ◽

Temperature Fluctuations ◽

Spray Cooling ◽

Fused Silica ◽

Measure Surface Temperature ◽

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A heater designed to monitor surface temperature fluctuations during pool boiling and spray cooling experiments while the bubbles are simultaneously being observed has been fabricated and tested. The heat source was a transparent indium tin oxide (ITO) layer commercially deposited on a fused quartz substrate. Four copper-nickel thin film thermocouples (TFTCs) on the heater surface measured the surface temperature, while a thin layer of sapphire or synthetic fused silica provided electrical insulation between the TFTCs and the ITO. The TFTCs were microfabricated using the lift-off process to deposit the nickel and copper metal films. The TFTC elements were 50μm wide and overlapped to form a 25×25μm2 junction. A DAQ program recorded the TFTC voltages at a sampling rate of 50kHz and sent a trigger to a high-speed camera to synchronize bubble images with the surface temperature data. As the bubbles and their contact rings grew over the TFTC junction, correlations between bubble behavior and surface temperature changes were demonstrated.

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Monolithic integration of an InGaAs/GaAs/AlGaAs strained layer SQW LED and GaAs MESFET using epitaxial lift-off

Electronics Letters ◽

10.1049/el:19900604 ◽

1990 ◽

Vol 26 (13) ◽

pp. 925 ◽

Cited By ~ 20

Author(s):

I. Polentier ◽

L. Buydens ◽

A. Ackaert ◽

P. Demeester ◽

P. van Daele ◽

...

Keyword(s):

Monolithic Integration ◽

Strained Layer ◽

Gaas Mesfet ◽

Lift Off

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A Microwave Platform for Reliable and Instant Interconnecting Combined with Microwave-Microfluidic Interdigital Capacitor Chips for Sensing Applications

Sensors ◽

10.3390/s20061687 ◽

2020 ◽

Vol 20 (6) ◽

pp. 1687

Author(s):

Juncheng Bao ◽

Gertjan Maenhout ◽

Tomislav Markovic ◽

Ilja Ocket ◽

Bart Nauwelaers

Keyword(s):

Dielectric Permittivity ◽

High Frequency ◽

Quartz Substrate ◽

Microfluidic Chips ◽

Interdigital Capacitor ◽

Sensing Applications ◽

Pdms Channel ◽

Spring System ◽

Lift Off ◽

The Stability

This work presents a novel platform conceived as an interconnect box (ICB) that brings high-frequency signals from microwave instruments to consumable lab-on-a-chip devices. The ICB can be connected to instruments with a standard coaxial connector and to consumable chips by introducing a spring-levered interface with elastomer conductive pins. With the spring-system, microwave-microfluidic chips can be mounted reliably on the setup in a couple of seconds. The high-frequency interface within the ICB is protected from the environment by an enclosure having a single slit for mounting the chip. The stability and repeatability of the contact between the ICB and inserted consumable chips are investigated to prove the reliability of the proposed ICB. Given the rapid interconnecting of chips using the proposed ICB, five different interdigital capacitor (IDC) designs having the same sensing area were investigated for dielectric permittivity extraction of liquids. The designed IDCs, embedded in a polydimethylsiloxane (PDMS) channel, were fabricated with a lift-off gold patterning technology on a quartz substrate. Water–Isopropanol (IPA) mixtures with different volume fractions were flushed through the channel over IDCs and sensed based on the measured reflection coefficients. Dielectric permittivity was extracted using permittivity extraction techniques, and fitted permittivity data shows good agreement with literature from 100 to 25 GHz.

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