A simplistic printed circuit board fabrication process for course projects

2000 ◽  
Vol 43 (3) ◽  
pp. 257-261 ◽  
Author(s):  
J. Branson ◽  
J. Naber ◽  
G. Edelen
Keyword(s):  
Printed Circuit Board ◽  
Fabrication Process ◽  
Circuit Board ◽  
Printed Circuit

Valve-Less Diaphragm Micropump with Electromagnetic Actuation

2013 ◽  
Vol 647 ◽  
pp. 929-934 ◽  
Author(s):  
Yaw Jen Chang ◽  
Yun Wei Chung ◽  
Ting An Chou ◽  
Min Fen Huang
Keyword(s):  
Flow Rate ◽  
Printed Circuit Board ◽  
Lab On A Chip ◽  
Control Circuit ◽  
Fabrication Process ◽  
Circuit Board ◽  
Pdms Layer ◽  
Electromagnetic Actuation ◽  
Casting Technique ◽  
Printed Circuit

In this paper, a micropump with electromagnetic actuation is presented. The micropump mainly consists of coil actuators and a PDMS micropump layer. The microcoil was fabricated using the printed circuit board (PCB) with the conventional PCB treatment and the PDMS layer was formed by casting technique. A control circuit was designed using microcontroller to produce square waves to control coil actuator. Due to the simple fabrication process, the micropump can be incorporated in a disposable PDMS lab-on-a-chip device as a fluid actuation component. However, the coil actuator is reusable. In addition, the control circuit makes the micropump portable. The experiment results show that this proposed micropump is capable of delivering a flow rate of 470 μL/min using one coil actuator.

A flexible RF transmitter module based on flexible printed circuit board by using micro-machining fabrication process

2010 ◽  
Vol 52 (12) ◽  
pp. 2636-2639
Author(s):  
Seong-Sik Myoung ◽  
Seon-Il Kim ◽  
Joo-Yong Jung ◽  
Dae-Ho Lim ◽  
Jeensang Jang ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Fabrication Process ◽  
Circuit Board ◽  
Micro Machining ◽  
Printed Circuit ◽  
Rf Transmitter ◽  
Flexible Printed Circuit

Droplet Movement on a Low Cost EWOD According to Applied Frequencies and Voltages

2011 ◽  
Vol 87 ◽  
pp. 140-145 ◽  
Author(s):  
Chadchawarn Phongsomboon ◽  
Kreeta Sukhthang ◽  
Wishsanuruk Wechsatol ◽  
Adisorn Tuantranont ◽  
Tanom Lomas
Keyword(s):  
Water Droplet ◽  
Printed Circuit Board ◽  
Electronic Materials ◽  
Low Cost ◽  
Fabrication Process ◽  
Circuit Board ◽  
Fabrication Technique ◽  
Printed Circuit ◽  
Droplet Movement ◽  
Electro Wetting

In this work, an electro-wetting on dielectric device (EWOD) with array style electrodes was fabricated from low price and common electronic materials. With its low cost and uncomplicated fabrication process, it is useful and feasible in teaching and educating young engineers on such droplet movement technique. The array electrodes were made from a common printed circuit board and copper tapes. The applied fabrication technique is mentioned in this paper. The water droplet movement in corresponding to the applied frequencies and voltage is reported.

scholarly journals Modelling, analysis, and acceleration of a printed circuit board fabrication process

Sadhana ◽  
2001 ◽  
Vol 26 (5) ◽  
pp. 447-463
Author(s):  
K. S. Aithal ◽  
Y. Narahari ◽  
E. Manjunath
Keyword(s):  
Printed Circuit Board ◽  
Fabrication Process ◽  
Circuit Board ◽  
Printed Circuit ◽  
Modelling Analysis

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

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