A Process for Multi‐level Copper‐polyimide High Density Interconnect Structures, Flex Circuits and TAB Tape
2020 ◽
Keyword(s):
2007 ◽
Vol 46
(6B)
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pp. 3771-3774
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2017 ◽
Vol 11
(9)
◽
pp. 1700227
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Keyword(s):
2017 ◽
Vol 21
(10)
◽
pp. 2134-2137
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Keyword(s):