Supersonic Ionization Wave Driven by Radiation Transport in a Short-Pulse Laser-Produced Plasma

1996 ◽  
Vol 77 (3) ◽  
pp. 498-501 ◽  
Author(s):  
T. Ditmire ◽  
E. T. Gumbrell ◽  
R. A. Smith ◽  
L. Mountford ◽  
M. H. R. Hutchinson
1995 ◽  
Author(s):  
Cornelius Wülker ◽  
Wolfgang Theobald ◽  
Donald Ouw ◽  
Fritz P. Schäfer ◽  
Boris N. Chichkov

1994 ◽  
Vol 112 (1-2) ◽  
pp. 21-28 ◽  
Author(s):  
Cornelius Wülker ◽  
Wolfgang Theobald ◽  
Donald Ouw ◽  
Fritz P. Schäfer ◽  
Boris N. Chichkov

2004 ◽  
Author(s):  
Samir Ellwi ◽  
Andrew Comley ◽  
N. Hay ◽  
Michael Brownell

Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.


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