scholarly journals Coupled electron–heat transport in nonuniform thin film semiconductor structures

2012 ◽  
Vol 86 (16) ◽  
Author(s):  
V. G. Karpov
1994 ◽  
Vol 1 (11) ◽  
pp. 3570-3576 ◽  
Author(s):  
J. M. Liu ◽  
J. S. De Groot ◽  
J. P. Matte ◽  
T. W. Johnston ◽  
R. P. Drake
Keyword(s):  

2003 ◽  
Vol 91 (4) ◽  
Author(s):  
T. M. Biewer ◽  
C. B. Forest ◽  
J. K. Anderson ◽  
G. Fiksel ◽  
B. Hudson ◽  
...  

2007 ◽  
Vol 51 (1) ◽  
pp. 112-121 ◽  
Author(s):  
S. Murakami ◽  
H. Yamada ◽  
A. Wakasa ◽  
H. Inagaki ◽  
K. Tanaka ◽  
...  

2009 ◽  
Vol 49 (7) ◽  
pp. 075025 ◽  
Author(s):  
A.K. Wang ◽  
H. Wang ◽  
H.B Jiang ◽  
Z.T Wang

2000 ◽  
Vol 7 (7) ◽  
pp. 2810-2823 ◽  
Author(s):  
S. Brunner ◽  
E. Valeo ◽  
J. A. Krommes
Keyword(s):  

2014 ◽  
Vol 9 (0) ◽  
pp. 1404096-1404096
Author(s):  
Akio NISHIGUCHI

Author(s):  
Tsung-Wen Tsai ◽  
Yung-Ming Lee

The effect of the contact conductance on micro-scale heat transport in a multi-layered metal thin-film subjected to ultra-fast pulse laser heating is investigated in this study. The interfacial contact conductance existing at the interface is included in the analysis. The parabolic two-step (PTS) model is applied to predict the electron and lattice temperature. The equations can be solved by Laplace transform and the Riemann-sum approximation. The results show that the contact conductance plays an important role in the micro-scale heat transport processes for a multi-layered metal thin-film. Hence, in order to eliminate the thermal failure of the surface layer, the thermal resistance existing at the interface should be as small as possible.


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