scholarly journals Charge and spin transport in spin valves with anisotropic spin relaxation

2007 ◽  
Vol 75 (7) ◽  
Author(s):  
H. Saarikoski ◽  
W. Wetzels ◽  
G. E. W. Bauer
Small ◽  
2014 ◽  
pp. n/a-n/a ◽  
Author(s):  
Saumil Bandyopadhyay ◽  
Md. Iftekhar Hossain ◽  
Hasnain Ahmad ◽  
Jayasimha Atulasimha ◽  
Supriyo Bandyopadhyay

2017 ◽  
Vol 95 (11) ◽  
Author(s):  
M. Ishikawa ◽  
T. Oka ◽  
Y. Fujita ◽  
H. Sugiyama ◽  
Y. Saito ◽  
...  

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
N. Yamashita ◽  
S. Lee ◽  
R. Ohshima ◽  
E. Shigematsu ◽  
H. Koike ◽  
...  

AbstractImprovement in the thermal tolerance of Si-based spin devices is realized by employing thermally stable nonmagnetic (NM) electrodes. For Au/Ta/Al electrodes, intermixing between Al atoms and Au atoms occurs at approximately 300 °C, resulting in the formation of a Au/Si interface. The Au–Si liquid phase is formed and diffuses mainly along an in-plane direction between the Si and AlN capping layers, eventually breaking the MgO layer of the ferromagnetic (FM) metal/MgO electrodes, which is located 7 µm away from the NM electrodes. By changing the layer structure of the NM electrode from Au/Ta/Al to Au/Ta, the thermal tolerance is clearly enhanced. Clear spin transport signals are obtained even after annealing at 400 °C. To investigate the effects of Mg insertion in FM electrodes on thermal tolerance, we also compare the thermal tolerance among Fe/Co/MgO, Fe/Co/Mg/MgO and Fe/Co/MgO/Mg contacts. Although a highly efficient spin injection has been reported by insertion of a thin Mg layer below or above the MgO layer, these thermal tolerances decrease obviously.


Sign in / Sign up

Export Citation Format

Share Document