Surface-roughness contributions to the electrical resistivity of polycrystalline metal films

1990 ◽  
Vol 41 (17) ◽  
pp. 11852-11857 ◽  
Author(s):  
U. Jacob ◽  
J. Vancea ◽  
H. Hoffmann
Keyword(s):  
Surface Roughness ◽  
Electrical Resistivity ◽  
Metal Films ◽  
Polycrystalline Metal

scholarly journals Numerical Evaluation of the Resistivity of Polycrystalline Metal Films With the Mayadas-Shatzkes Model

1974 ◽  
Vol 1 (1) ◽  
pp. 77-80 ◽  
Author(s):  
E. E. Mola ◽  
J. M. Heras
Keyword(s):  
Experimental Data ◽  
Electrical Resistivity ◽  
Numerical Evaluation ◽  
Metal Films ◽  
Polycrystalline Films ◽  
Polycrystalline Metal ◽  
Resistivity Model ◽  
Gauss Method

Numerical Tables are given in order to allow a direct comparison of the electrical resistivity model for polycrystalline films proposed by Mayadas–Shatzkes with experimental data.The tables have been calculated extending the Gauss method for one variable to many variables.

Nanoscale evaluation of surface roughness of metal films prepared by laser ablation

1998 ◽  
Vol 66 (7) ◽  
pp. S815-S818 ◽  
Author(s):  
T. Sumomogi ◽  
H. Sakai ◽  
M. Nakata ◽  
T. Endo
Keyword(s):  
Surface Roughness ◽  
Laser Ablation ◽  
Metal Films

The Influence of Charge Effects on the Growth and Electrical Resistivity of Thin Metal Films

1967 ◽  
Vol 38 (4) ◽  
pp. 1986-1987 ◽  
Author(s):  
D. I. Kennedy ◽  
R. E. Hayes ◽  
R. W. Alsford
Keyword(s):  
Electrical Resistivity ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Charge Effects

Surface roughness dependence of the electrical resistivity of W(001) layers

2017 ◽  
Vol 122 (9) ◽  
pp. 095304 ◽  
Author(s):  
P. Y. Zheng ◽  
T. Zhou ◽  
B. J. Engler ◽  
J. S. Chawla ◽  
R. Hull ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Electrical Resistivity

Sputtered Silicon for Microstructures and Microcavities

1999 ◽  
Author(s):  
Kenneth A. Honer ◽  
Gregory T. A. Kovacs
Keyword(s):  
Surface Roughness ◽  
Electrical Resistivity ◽  
Low Temperature ◽  
Film Thickness ◽  
Plane Stress ◽  
Strain Gradient ◽  
Sacrificial Layer ◽  
Low Temperature Annealing ◽  
Deposition Power ◽  
Density Surface

Abstract Sputtered silicon can be used to make released microstructures at temperatures compatible with prefabricated aluminum-metallized CMOS circuitry. The fabrication sequence is similar to LPCVD polysilicon processes and involves a wet release from an oxide sacrificial layer. This process was used to fabricate a variety of test structures, including cantilevers, combs, and spirals. During release of the structures porosity to HF was observed in films up to 5 μm thick. This porosity resulted in the formation of completely enclosed cavities formed beneath silicon membranes over oxide sacrificial layers, and may have implications for the packaging of released devices. Several properties of the sputtered silicon films were investigated, including their in-plane stress, strain gradient, film density, surface roughness, electrical resistivity, and permeability. The dependency of these properties on deposition power, pressure, and film thickness as well as the effects of low-temperature annealing were also investigated.

scholarly journals Printability and Properties of Conductive Inks on Primer-Coated Surfaces

2019 ◽  
Vol 2019 ◽  
pp. 1-8
Author(s):  
Hector R. Mendez-Rossal ◽  
Gernot M. Wallner
Keyword(s):  
Electrical Conductivity ◽  
Surface Roughness ◽  
Electrical Resistivity ◽  
Screen Printing ◽  
Good Adhesion ◽  
Laser Confocal Microscopy ◽  
Conductive Inks ◽  
Coated Metal ◽  
Coated Surfaces ◽  
Resistivity Testing

Conductive inks’ performance is affected by the printing conditions and the substrate’s properties. In this study, one graphite-, one polymer-, and two silver-based conductive inks were printed on four primer-coated metal substrates by screen printing. The compatibility and wettability between the inks and the primers were evaluated by infrared spectroscopy and surface energy measurements. The printed structures were characterized by laser confocal microscopy, peel-off tape testing, and four-point probe electrical resistivity testing. In general, silver inks exhibited the best performance in terms of printability and electrical conductivity. The graphite ink presented the worst printing, adhesion, and functional properties. The polymer-based ink revealed poor wettability but good adhesion and functionality. The surface roughness, energy, and polarity of the primer coating had no significant influence on the electrical conductivity of the printed inks.

Sign in / Sign up

Export Citation Format

Share Document