scholarly journals High-Frequency Mechanical Excitation of a Silicon Nanostring with Piezoelectric Aluminum Nitride Layers

2020 ◽  
Vol 14 (1) ◽  
Author(s):  
Alessandro Pitanti ◽  
Tapani Makkonen ◽  
Martin F. Colombano ◽  
Simone Zanotto ◽  
Leonardo Vicarelli ◽  
...  
1999 ◽  
Vol 572 ◽  
Author(s):  
C. M. Lueng ◽  
H. L. W. Chan ◽  
W. K. Fong ◽  
C. Surya ◽  
C. L. Choy

ABSTRACTAluminum nitride (AlN) and gallium nitride (GaN) thin films have potential uses in high temperature, high frequency (e.g. microwave) acoustic devices. In this work, the piezoelectric coefficients of wurtzite AlN and GaN/AlN composite film grown on silicon substrates by molecular beam epitaxy were measured by a Mach-Zehnder type heterodyne interferometer. The effects of the substrate on the measured coefficients are discussed.


2017 ◽  
Vol 27 (2) ◽  
pp. 105-107 ◽  
Author(s):  
Cristian Cassella ◽  
Nicolo Oliva ◽  
Jeffrey Soon ◽  
Merugu Srinivas ◽  
Navab Singh ◽  
...  

2012 ◽  
Vol 520 (7) ◽  
pp. 3060-3063 ◽  
Author(s):  
E. Iborra ◽  
M. Clement ◽  
J. Capilla ◽  
J. Olivares ◽  
V. Felmetsger

1999 ◽  
Vol 224 (1) ◽  
pp. 243-250 ◽  
Author(s):  
Marc-Alexandre Dubois ◽  
Paul Muralt ◽  
Laurent Sagalowicz

1996 ◽  
Vol 423 ◽  
Author(s):  
C. -M. Zetterling ◽  
K. Wongchotigul ◽  
M. G. Spencer ◽  
C. I. Harris ◽  
S. S. Wong ◽  
...  

AbstractUndoped single crystalline aluminum nitride films were grown by metal organic chemical vapor deposition (MOCVD) at 1200 °C. The precursors used were trimethylaluminium (TMA) and ammonia (NH3) in a hydrogen carrier flow, at a pressure of 10 Torr. Silicon carbide substrates of the 4H or the 6H polytype with an epilayer on the silicon face, were used to grow the 200 nm thick A1N films. Aluminum was evaporated and subsequently patterned to form MIS capacitors for high frequency (400 kHz) capacitance voltage measurements at room temperature. It was possible to measure the structure and characterize accumulation, depletion and deep depletion. However, it was not possible to invert the low doped SiC epilayer at room temperature. From an independent optical thickness measurement the relative dielectric constant of aluminum nitride was calculated to be 8.4. The films were stressed up to 50 Volts (2.5 MV/cm) without breakdown or excessive leakage currents. These results indicate the possibility to replace silicon dioxide with aluminum nitride in SiC field effect transistors.


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