Domain Boundary Motion in Ferroelectric Crystals and the Dielectric Constant at High Frequency

1951 ◽  
Vol 83 (2) ◽  
pp. 458-458 ◽  
Author(s):  
C. Kittel
2021 ◽  
Vol 118 (12) ◽  
pp. 122403
Author(s):  
Rowan C. Temple ◽  
Mark C. Rosamond ◽  
Jamie R. Massey ◽  
Trevor P. Almeida ◽  
Edmund H. Linfield ◽  
...  

A comb shaped microstrip antenna is designed by loading rectangular slots on the patch of the antenna. The antenna resonating at three different frequencies f1 = 5.35 GHz, f2 = 6.19 GHz and f3= 8.15 GHz. The designed antenna is simulated on High Frequency Structure Simulator software [HFSS] and the antenna is fabricated using substrate glass epoxy with dielectric constant 4.4 having dimension of 8x4x0.16 cms. The antenna shows good return loss, bandwidth and VSWR. Experimental results are observed using Vector Analyzer MS2037C/2.


Author(s):  
С.А. Корчагин ◽  
Д.В. Терин

A method is proposed for modeling the complex dielectric constant of an anisotropic hierarchically constructed nanocomposite with a periodic structure, based on the complex application of quantum mechanical calculations, an effective medium model, and equivalent equivalent circuits. The dielectric constant of the TiO2 - Al2O3 nanocomposite under the action of external high-frequency electromagnetic radiation has been investigated. The wavelength ranges at which resonance bursts are observed are determined. The possibility of controlling the maxima of difference losses and resonance absorption maxima by changing the geometric parameters of the nanocomposite is shown.


2018 ◽  
Vol 2018 (1) ◽  
pp. 000476-000482 ◽  
Author(s):  
Masao Tomikawa ◽  
Hitoshi Araki ◽  
Yohei Kiuchi ◽  
Akira Shimada

Abstract Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics.


Nanomaterials ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 492 ◽  
Author(s):  
Moustafa A. Darwish ◽  
Alex V. Trukhanov ◽  
Oleg S. Senatov ◽  
Alexander T. Morchenko ◽  
Samia A. Saafan ◽  
...  

A pure ferrite and epoxy samples as well as the epoxy/ferrite composites with different 20 wt.%, 30 wt.%, 40 wt.%, and 50 wt.% weight ferrite contents have been prepared by the chemical co-precipitation method. AC-conductivity and dielectric properties such as the dielectric constant and dielectric loss of the prepared samples have been studied. The obtained results showed that the samples had a semiconductor behavior. The dielectric constant of the composites has been calculated theoretically using several models. For the composite sample that contains 20 wt.% of ferrites, these models give satisfactory compliance, while for the composite samples with a higher percentage of nanofillers, more than 30 wt.% theoretical results do not coincide with experimental data. The investigated polymer has very low conductivity, so this type of polymer can be useful for high-frequency applications, which can reduce the losses caused by eddy current. Thus, the prepared samples are promising materials for practical use as elements of microwave devices.


1986 ◽  
Vol 72 ◽  
Author(s):  
M. Kahn ◽  
B. Kriese

AbstractFugitive ink and tape technology permit the inclusion of flat voids at predetermined locations in ceramic microcircuit substrates. Calculations show that critical stray capacitances can be reduced by as much as 65% and the propagation delay of microstrip transmission lines by 30% and more. The selectivity of the void location permits the retention of the full thermal conductance of the substrate under heat dissipating elements.


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