Stress Relaxation by Interstitial Atomic Diffusion in Tantalum

1948 ◽  
Vol 74 (1) ◽  
pp. 16-20 ◽  
Author(s):  
T'ing-sui Kê
Keyword(s):  
Stress Relaxation ◽  
Atomic Diffusion

On the Role of Surface Diffusion in Stress Relaxation During Electromigration

1995 ◽  
Vol 391 ◽  
Author(s):  
L.M. Klinger ◽  
L. Levin ◽  
E.E. Glickman
Keyword(s):  
Stress Relaxation ◽  
Surface Diffusion ◽  
Hydrostatic Stress ◽  
Stress Gradient ◽  
Film Surface ◽  
Diffusional Creep ◽  
Atomic Diffusion ◽  
Material Transport ◽  
Diffusional Flux

AbstractWe report on the role of surface diffusion involved in relaxation of electromigration (EM) induced compressive stresses in relation to hillock growth and EM behavior of interconnects. Two competing mechanisms of EM stress relaxation by material transport onto the surface are considered. The first is hillocking by threshold diffusional creep (TCH), with rather large blocks of material (grains or group of grains) involved in plastic flow. The second mechanism, atomic diffusion hillocking (ADH), is presumed to be a nonthreshold one, and represents atomic grain boundary (GB) diffusion stimulated by the hydrostatic stress gradient in the direction normal to the film surface. The latter process involves surface diffusion because GB diffusional flux onto the surface must be coupled with the flux of redistribution of the atoms over the surface. If ADH acts rapidly, this should prevent the build-up of the matter at the down-wind (anode) end of the stripe, and thus, eliminate the Blech EM threshold resulting from the stress-gradient along the stripe. The question as to whether GB diffusion capable of transporting atoms pushed by electron wind along the stripe is also effective in relieving compressive stress by GB migration of the surplus atoms in the normal direction, has remained open up to now. The problem is especially acute for short or/and narrow lines separated into short polycrystalline segments, where the Blech threshold effects are critical to EM reliability.We derived the main features of the EM behavior in drift velocity test geometry assuming that both TCH and ADH are operative. The result can be compared with available and future experimental observations in order to reveal if and when the ADH mechanism with surface diffusion involved works.

scholarly journals Atomic diffusion induced by stress relaxation in InGaAs/GaAs epitaxial layers

1997 ◽  
Vol 82 (3) ◽  
pp. 1147-1152 ◽  
Author(s):  
P. Roura ◽  
A. Vilà ◽  
J. Bosch ◽  
M. López ◽  
A. Cornet ◽  
...  
Keyword(s):  
Stress Relaxation ◽  
Atomic Diffusion ◽  
Epitaxial Layers

Stress Relaxation and the Formation of Silicides in the Process of the Crystallization of NI-NB Films on SI

1991 ◽  
Vol 49 ◽  
pp. 898-899
Author(s):  
N. Rozhanski ◽  
V. Lifshitz
Keyword(s):  
Thin Films ◽  
Stress Relaxation ◽  
Integrated Circuits ◽  
Direct Evidence ◽  
Alloy Film ◽  
Diffusion Barriers ◽  
Effective Barrier

Thin films of amorphous Ni-Nb alloys are of interest since they can be used as diffusion barriers for integrated circuits on Si. A native SiO2 layer is an effective barrier for Ni diffusion but it deformation during the crystallization of the alloy film lead to the appearence of diffusion fluxes through it and the following formation of silicides. This study concerns the direct evidence of the action of stresses in the process of the crystallization of Ni-Nb films on Si and the structure of forming NiSi2 islands.

BDNF Val⁶⁶Met polymorphism to generalized anxiety disorder pathways: Indirect effects via attenuated parasympathetic stress-relaxation reactivity.

2020 ◽  
Vol 129 (3) ◽  
pp. 237-247 ◽  
Author(s):  
Hsin-An Chang ◽  
Wen-Hui Fang ◽  
Yia-Ping Liu ◽  
Nian-Sheng Tzeng ◽  
Jia-Fwu Shyu ◽  
...  
Keyword(s):  
Anxiety Disorder ◽  
Stress Relaxation ◽  
Generalized Anxiety Disorder ◽  
Indirect Effects ◽  
Generalized Anxiety

STRESS RELAXATION IN SOLIDS

1987 ◽  
Vol 48 (C8) ◽  
pp. C8-3-C8-13 ◽  
Author(s):  
J. KUBÁT ◽  
M. RIGDAHL
Keyword(s):  
Stress Relaxation

Comparative study of the effective parameters on residual stress relaxation in welded aluminum plates under cyclic loading

2020 ◽  
Vol 21 (5) ◽  
pp. 505
Author(s):  
Yousef Ghaderi Dehkordi ◽  
Ali Pourkamali Anaraki ◽  
Amir Reza Shahani
Keyword(s):  
Residual Stress ◽  
Cyclic Loading ◽  
Stress Relaxation ◽  
Stress Amplitude ◽  
Cyclic Plasticity ◽  
Mean Stress ◽  
Effective Parameters ◽  
Perfect Plasticity ◽  
Residual Stress Relaxation ◽  
Aluminum Plates

The prediction of residual stress relaxation is essential to assess the safety of welded components. This paper aims to study the influence of various effective parameters on residual stress relaxation under cyclic loading. In this regard, a 3D finite element modeling is performed to determine the residual stress in welded aluminum plates. The accuracy of this analysis is verified through experiment. To study the plasticity effect on stress relaxation, two plasticity models are implemented: perfect plasticity and combined isotropic-kinematic hardening. Hence, cyclic plasticity characterization of the material is specified by low cycle fatigue tests. It is found that the perfect plasticity leads to greater stress relaxation. In order to propose an accurate model to compute the residual stress relaxation, the Taguchi L18 array with four 3-level factors and one 6-level is employed. Using statistical analysis, the order of factors based on their effect on stress relaxation is determined as mean stress, stress amplitude, initial residual stress, and number of cycles. In addition, the stress relaxation increases with an increase in mean stress and stress amplitude.

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