scholarly journals Tunnel magnetoresistance effect and magnetic damping in half-metallic Heusler alloys

Author(s):  
M. Oogane ◽  
S. Mizukami

Some full-Heusler alloys, such as Co 2 MnSi and Co 2 MnGe, are expected to be half-metallic ferromagnetic material, which has complete spin polarization. They are the most promising materials for realizing half-metallicity at room temperature owing to their high Curie temperature. We demonstrate a huge tunnel magnetoresistance effect in a magnetic tunnel junction using a Co 2 MnSi Heusler alloy electrode. This result proves high spin polarization of the Heusler alloy. We also demonstrate a small magnetic damping constant in Co 2 FeAl epitaxial film. The very high spin polarization and small magnetic constant of Heusler alloys will be a great advantage for future spintronic device applications.

2019 ◽  
Vol 115 (17) ◽  
pp. 172401 ◽  
Author(s):  
C. Guillemard ◽  
S. Petit-Watelot ◽  
J.-C. Rojas-Sánchez ◽  
J. Hohlfeld ◽  
J. Ghanbaja ◽  
...  

2015 ◽  
Vol 394 ◽  
pp. 82-86 ◽  
Author(s):  
Lakhan Bainsla ◽  
A.I. Mallick ◽  
A.A. Coelho ◽  
A.K. Nigam ◽  
B.S.D.Ch.S. Varaprasad ◽  
...  

2020 ◽  
Vol 32 (20) ◽  
pp. 205901
Author(s):  
Xiao Hu ◽  
Yaqiong Zhang ◽  
Shuaiyu Fan ◽  
Xin Li ◽  
Zhenjie Zhao ◽  
...  

2011 ◽  
Vol 470 ◽  
pp. 54-59
Author(s):  
Hiroyoshi Itoh ◽  
Syuta Honda ◽  
Junichiro Inoue

The electronic structures of Co-based Heusler alloys with nonstoichiometric atomic compositions as well as those at the interface of semiconductor junctions are investigated using first principles band calculations. It is shown that the electronic structure of a Co-based Heusler alloy is half-metallic, even for nonstoichiometric but Co-rich compositions, whereas the half-metallicity is lost for Co-poor compositions. It is also shown that magnetic moments at the interface of Co2MnSi/ Si junctions are sensitive to the growth direction and interface structure of the junctions. Efficient spin-injection into Si can be achieved by using a (111)-oriented Co-rich Heusler alloy and controlling the layer-by-layer stacking sequence at the interface.


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