scholarly journals Testicular Toxicity of Gallium Arsenide, Indium Arsenide, and Arsenic Oxide in Rats by Repetitive Intratracheal Instillation

1996 ◽  
Vol 32 (1) ◽  
pp. 72-78 ◽  
Author(s):  
MINORU OMURA ◽  
AKIYO TANAKA ◽  
MIYUKI HIRATA ◽  
MANGEN ZHAO ◽  
YUJI MAKITA ◽  
...  
1996 ◽  
Vol 89 (2) ◽  
pp. 123-129 ◽  
Author(s):  
Minoru Omura ◽  
Miyuki Hirata ◽  
Akiyo Tanaka ◽  
Mangen Zhao ◽  
Yuji Makita ◽  
...  

2002 ◽  
Vol 316-317 ◽  
pp. 198-201 ◽  
Author(s):  
A.J. Kent ◽  
A.V. Akimov ◽  
S.A. Cavill ◽  
R.J. Bellingham ◽  
M. Henini

1999 ◽  
Vol 570 ◽  
Author(s):  
D.F. Storm ◽  
M.D. Lange

ABSTRACTBecause of the large lattice mismatch between InAs and GaAs, the growth of the former on the (001) surface of the latter undergoes a well-known transition from a layer-by-layer mode to an island mode at an equivalent coverage of 1–2 monolayers (ML). We have observed a suppression of this transition when growth proceeds under a simultaneous thallium flux. The thallium is not significantly incorporated into the InAs layer; however, approximately I ML may remain at the interface. The effect of the thallium on the electronic properties of the InAs is investigated.


2018 ◽  
Vol 284 ◽  
pp. 198-203
Author(s):  
S.N. Chebotarev ◽  
V.A. Irkha ◽  
Adnan A.A. Mohamed

We proposed an experimental technique for determining the sputtering yields of two-component semiconductors – gallium arsenide and indium arsenide by low-energy argon ions. It was suggested to measure the volume of a crater formed by inert ions bombarding on the target surface using the method of scanning laser confocal microscopy. It was demonstrated that in the energy range from 100 to 300 eV, the energy dependence of sputtering yields for these materials is practically linear. It is established that the sputtering yields for normal bombardment by argon ions at optimum energy of 150 eV are equal to Y(GaAs) = 0.41 and Y(InAs) = 0.73. It is found that an increase in the etching time of the surface of gallium arsenide and indium arsenide leads to a characteristic transformation of the surface relief. The studies of the sputtering of two-component targets indicate the initial strong non-stechiometry. Etching for a certain period of time leads to an equalization of the concentrations of the sputtered components. It was found that to obtain a uniform composition of the mass flow it is necessary to pre-sputter the targets with shielded substrates.


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