Construction of Three-Dimensional Dermo–Epidermal Skin Equivalents Using Cell Coating Technology and Their Utilization as Alternative Skin for Permeation Studies and Skin Irritation Tests

2017 ◽  
Vol 23 (11-12) ◽  
pp. 481-490 ◽  
Author(s):  
Takami Akagi ◽  
Mayuka Nagura ◽  
Ayami Hiura ◽  
Hajime Kojima ◽  
Mitsuru Akashi
Keyword(s):  
Skin Irritation ◽  
Three Dimensional ◽  
Coating Technology ◽  
Skin Equivalents ◽  
Cell Coating ◽  
Permeation Studies

Development of full-thickness human skin equivalents with blood and lymph-like capillary networks by cell coating technology

2015 ◽  
Vol 103 (10) ◽  
pp. 3386-3396 ◽  
Author(s):  
Michiya Matsusaki ◽  
Kumiko Fujimoto ◽  
Yuji Shirakata ◽  
Satoshi Hirakawa ◽  
Koji Hashimoto ◽  
...  
Keyword(s):  
Human Skin ◽  
Full Thickness ◽  
Coating Technology ◽  
Capillary Networks ◽  
Skin Equivalents ◽  
Cell Coating

Optimization of the Coating Technology for Super-Porous Propellant

2020 ◽  
Vol 984 ◽  
pp. 177-182
Author(s):  
Meng Lei Zhou ◽  
Li Na Zhang ◽  
Yang Liu ◽  
Feng Qiang Nan
Keyword(s):  
Impact Test ◽  
Three Dimensional ◽  
Single Layer ◽  
Video Observation ◽  
Coating Technology ◽  
Cladding Layer ◽  
Different Temperatures ◽  
Mechanical Performances ◽  
Cladding Layers ◽  
Layer Coating

In order to obtain better quality and mechanical performances, the coating process of super-porous propellants was optimized. The mechanical performances of super-porous propellants were tested, under some conditions with different temperatures, different numbers of cladding layers, different thicknesses of the cladding layer and different ratios of inner and outer layers, through many different analytical methods including impact test, interrupted-burning test and three-dimensional video observation test. The results show that the mechanical performances of super-porous propellants are positively correlated with the temperature, the coating thickness and the ratio of the outer layer. The double-layer coating also can obtain better coating effect than the single-layer coating.

Formulation and Evaluation of Nanosponges loaded Bifonazole for Fun-gal Infection

2020 ◽  
Vol 18 ◽  
Author(s):  
Amaravathi Murali Krishna ◽  
Venkatesh Dinnekere Putte Gowda ◽  
Roopa Karki
Keyword(s):  
Drug Release ◽  
Fungal Infections ◽  
Skin Irritation ◽  
In Vitro Release ◽  
Three Dimensional ◽  
Entrapment Efficiency ◽  
In Vitro Drug Release ◽  
Model Stability ◽  
Novel Approach

Background: Nanosponges is a novel approach of topical drug delivery, especially for the fungal infections. Nanosponges are a unique class of nanoparticles with three-dimensional nanostructure in nanometers wide cavities, which can encapsulate both hydrophilic and lipophilic substances, will provide increased efficacy and safety. Objective: To formulate and evaluate Bifonazole loaded nanosponges in hydrogels for the treatment of fungal diseases. Methods: Bifonazole-loaded nanosponges to be formulated using emulsion solvent diffusion technique. Interaction of drugethyl cellulose polymer along with other excipients’ was done by using FTIR as well as DSC. The nanosponges formulations were evaluated with different parameters. Results: Bifonazole loaded nanosponges’ particle size and zeta potential for formulations were between the range of 183.7 to 560.2 nm and –17.77 to –21.9 mV, respectively. Surface morphology of nanosponges by SEM disclosed that it was spherical and porous in nature. Drug entrapment efficiency was found to be 45.44 to 79.71%. The drug release study was done by using phosphate buffer pH 6.8. Further in vitro release data is fitted in to kinetic models. The optimized formulation M6 has incorporated hydrogels, further evaluated skin irritation, in vitro drug release, viscosity and pH using a rat model. Stability studies of hydrogel formulation MH2 revealed that no changes in in-vitro drug release, pH and drug content study at the completion of 6 months. Conclusion: Thus, it indicated that the prepared Bifonazole loaded nanosponges into hydrogel was stable. Hence, it could be a suitable dosage form for the cure of fungal infections in the skin.

Enabling Resist Processing Technologies for Advanced Packaging

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 000830-000862 ◽  
Author(s):  
Antun Peic ◽  
Thorsten Matthias ◽  
Johanna Bartl ◽  
Paul Lindner
Keyword(s):  
Three Dimensional ◽  
Design Solution ◽  
Wafer Level ◽  
Coating Technology ◽  
3D Ic ◽  
Wafer Level Packaging ◽  
Aspect Ratios ◽  
Integration Schemes ◽  
Interconnect Design ◽  
Deep Cavities

The increasing adoption of advanced wafer-level packaging (WLP) technologies and high density interposer concepts clearly reflect the permanent need for form factor reduction, smaller process geometries and higher-count I/O on ICs. Currently, several strategies are being pursued to achieve these goals. The most promising approaches are summarized under the concept of three-dimensional integrated circuits (3D-IC) and three-dimensional wafer level packaging (3D-WLP) technology. A key component for 3D device integration schemes is the requirement of vertical through-silicon-via (TSV) interconnections that enables electrical through-chip communication through stacks of vertically integrated layers on the wafer scale. Ultimately, the use of TSVs also enables higher performance and smaller package sizes. In order to realize TSV connections, a series of process steps is required such as the thinning and bonding of the wafer to a carrier prior to the formation of through-wafer vias, followed by the passivation and metallization of the vias. Despite the potential benefits associated with the integration of TSVs also significant challenges have to be overcome. One of the greatest challenges for present and even more for upcoming TSV design strategies still remains the processing of photoresist and other functional polymers at and within TSV geometries. To this day, it is still very difficult to achieve a conformal polymer coating in deep cavities, along steep side walls and especially within the extreme aspect ratios of TSV. Mainly this is due to the fact that standard surface coating methods such as spin coating were just not developed to meet the requirements posed by these high aspect ratio microstructures. New and innovative approaches are needed to meet these new challenges. Spray coating is one of the most promising technologies to overcome current barriers. However, even most of the available spray deposition equipment is facing its limits with steadily decreasing via diameters and increasing aspect ratios on the other hand. Successively, the multitude of these challenging technological developments in the 3D-IC and wafer-level packaging area has created the demand for innovative manufacturing approaches, new equipment and related tools. Herein we present our new EVG ®NanoSprayTM coating technology with unique capabilities to overcome the present limits of conformal resist coating over extreme topography. We demonstrate one particularly promising application for conformal polymer coatings; as an annular lining at the interface between the conducting metal filling in the TSV and the silicon wafer. The intrinsic properties of the polymer allow a TSV design solution that is more forgiving on coefficient of thermal expansion (CTE) mismatch-induced stress between the silicon substrate and the interfacing metal. Consequently, this new type of polymer buffered TSV interconnect design promises to significantly reduce thermal stress-induced TSV delamination as one of the dominant failure modes for 3-D interconnects. We further demonstrate the application of EVG ®NanoSprayTM as enabling coating technology for llithographic processing of conformal coated TSVs. The patterning of thin photoresist layers at the bottom of vias and along the steep sidewalls of deep cavities allows for more degrees of freedom in electrical contact formation. The presented EVG ®NanoSprayTM coating technology opens new dimensions in advanced wafer level packaging and provokes reconsidering prevailing limitations in interconnect design.

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