scholarly journals Micromagnetic modelling of stripe domains in thin films with a columnar microstructure

AIP Advances ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 015319
Author(s):  
E. Yu. Dengina ◽  
A. S. Bolyachkin ◽  
N. A. Kulesh ◽  
V. O. Vas’kovskiy
Keyword(s):  
Thin Films ◽  
Columnar Microstructure

Nanosized columnar microstructure and related properties of electron gun deposited Al2O3 thin films

Vacuum ◽  
2004 ◽  
Vol 76 (2-3) ◽  
pp. 211-214 ◽  
Author(s):  
E. Krumov ◽  
V. Mankov ◽  
K. Starbova
Keyword(s):  
Thin Films ◽  
Electron Gun ◽  
Columnar Microstructure

Anisotropic thermal conductivity of rare earth–transition metal thin films

1992 ◽  
Vol 7 (2) ◽  
pp. 329-334 ◽  
Author(s):  
L.J. Shaw-Klein ◽  
T.K. Hatwar ◽  
S.J. Burns ◽  
S.D. Jacobs ◽  
J.C. Lambropoulos
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Rare Earth ◽  
Transition Metal ◽  
Columnar Microstructure ◽  
Deposition Pressure ◽  
Metal Thin Films ◽  
Anisotropic Thermal Conductivity ◽  
Out Of Plane ◽  
Order Of Magnitude

Thermal conductivity measurements were performed on several amorphous rare earth transition metal thin films of varying microstructure. The thermal conductivity perpendicular to the plane of the film, measured by the thermal comparator method, was compared with the thermal conductivity value measured parallel to the plane of the film. The latter value was obtained by converting electrical conductivity values to thermal conductivity via the Wiedemann–Franz relationship. As expected, the columnar microstructure induced during the sputter deposition of the thin films causes an anisotropy in the thermal conductivity values, with the in-plane values consistently lower than the out-of-plane values. The effect is most pronounced for the more columnar films deposited at higher pressure, for which the in-plane thermal conductivity, 0.3 W/mK, is an order of magnitude lower than the out-of-plane thermal conductivity, 4.3 W/mK. The thermal conductivity out of the plane of the film decreased with increasing deposition pressure, due to the decreasing film density.

Lpcvd Polycrystalline Silicon Thin Films: The Evolution of Structure, Texture and Stress

1990 ◽  
Vol 202 ◽  
Author(s):  
P. Krulevitch ◽  
Tai D. Nguyen ◽  
G. C. Johnson ◽  
R. T. Howe ◽  
H. R. Wenk ◽  
...  
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Compressive Stress ◽  
Polycrystalline Silicon ◽  
Amorphous State ◽  
Processing Conditions ◽  
Columnar Microstructure ◽  
Silicon Thin Films ◽  
Evolution Of Structure ◽  
Polycrystalline Silicon Films

ABSTRACTAn investigation of undoped LPCVD polycrystalline silicon films deposited at temperatures ranging from 605 to 700 C and silane pressures from 300 to 550 mTorr revealed large variations in stress with processing conditions and a correlation between stress and texture. TEM and HRTEM analysis show that morphology differences also exist. At lower temperatures (≈605 C) and higher pressures (≈400 mTorr), the films appear to deposit in an amorphous state and crystallize during the deposition to form microstructures characterized by equi-axed grains, tensile residual stress, and a texture with {110} and {11/} (/=2 or 3) components. Higher temperatures (between 620 and 650 C) produce films that nucleate at the Si02 interface, creating a {110} oriented columnar microstructure. At 700 C, the grains are still columnar, but the dominant texture is {100}. Films deposited at temperatures greater than 620 C exhibit compressive stress, and some contain regions of hexagonal silicon. This paper proposes possible causes of the varying stresses, textures, and microstructures in the films.

The influence of columnar microstructure on diffusion reaction between Ti thin films and aluminum nitride ceramics

2019 ◽  
Vol 380 ◽  
pp. 125057
Author(s):  
Xiang Li ◽  
Hongkai Zhang ◽  
Chen Wang ◽  
Tingting Wang ◽  
Terigele ◽  
...  
Keyword(s):  
Thin Films ◽  
Aluminum Nitride ◽  
Diffusion Reaction ◽  
Columnar Microstructure ◽  
Nitride Ceramics

Microstructure and Tribological Properties OF Co-Cr thin Films Deposited by Facing Targets Sputtering and Magnetron Sputtering Methods

1991 ◽  
Vol 239 ◽  
Author(s):  
Sadao Kadokura ◽  
Masahiko Naoe
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Tribological Properties ◽  
Columnar Structure ◽  
Plastic Substrate ◽  
Homogeneous Distribution ◽  
Columnar Microstructure ◽  
Tribological Test ◽  
Surface Profiles ◽  
Facing Target Sputtering

ABSTRACTThe tribological properties and the slid surface profiles of Co-Cr thin films deposited by Facing Targets sputtering and Magnetron sputtering methods were investigated in regard to the durability of flexible disks. Co-Cr thin films with columnless microstructure and homogeneously packed particles were much tougher than ones with columnar microstructure for tribological test. The Co-Cr films deposited by conventional Magnetron sputtering method revealed typically columnar structure, while ones deposited by Facing Target sputtering method did columnless microstructure. This indicates probably homogeneous distribution of strong bonding forces between grain boundaries throughout the films, because no brittle fracture was observed even after the delamination between a plastic substrate and the CoOx/ Co-Cr / Ni-Fe triple layers took place by application of excess stresses. It was found that difference in morphology of Co-Cr thin film between Facing Target sputtering and conventional Magnetron sputtering methods was much significant.

scholarly journals Structural and Electric Properties of Epitaxial Na0.5Bi0.5TiO3-Based Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 651
Author(s):  
Bruno Magalhaes ◽  
Stefan Engelhardt ◽  
Christian Molin ◽  
Sylvia E. Gebhardt ◽  
Kornelius Nielsch ◽  
...  
Keyword(s):  
Thin Films ◽  
Room Temperature ◽  
Bottom Electrode ◽  
Laser Deposition ◽  
Dielectric Measurements ◽  
Columnar Microstructure ◽  
Bulk Materials ◽  
Lattice Matching ◽  
High Roughness

Substantial efforts are dedicated worldwide to use lead-free materials for environmentally friendly processes in electrocaloric cooling. Whereas investigations on bulk materials showed that Na0.5Bi0.5TiO3 (NBT)-based compounds might be suitable for such applications, our aim is to clarify the feasibility of epitaxial NBT-based thin films for more detailed investigations on the correlation between the composition, microstructure, and functional properties. Therefore, NBT-based thin films were grown by pulsed laser deposition on different single crystalline substrates using a thin epitaxial La0.5Sr0.5CoO3 layer as the bottom electrode for subsequent electric measurements. Structural characterization revealed an undisturbed epitaxial growth of NBT on lattice-matching substrates with a columnar microstructure, but high roughness and increasing grain size with larger film thickness. Dielectric measurements indicate a shift of the phase transition to lower temperatures compared to bulk samples as well as a reduced permittivity and increased losses at higher temperatures. Whereas polarization loops taken at −100 °C revealed a distinct ferroelectric behavior, room temperature data showed a significant resistive contribution in these measurements. Leakage current studies confirmed a non-negligible conductivity between the electrodes, thus preventing an indirect characterization of the electrocaloric properties of these films.

scholarly journals Tilt of the columnar microstructure in off-normally deposited thin films using highly ionized vapor fluxes

2013 ◽  
Vol 113 (17) ◽  
pp. 174906 ◽  
Author(s):  
V. Elofsson ◽  
D. Magnfält ◽  
M. Samuelsson ◽  
K. Sarakinos
Keyword(s):  
Thin Films ◽  
Columnar Microstructure
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