A differential thin film resistance thermometry method for peak thermal conductivity measurements of high thermal conductivity crystals

2021 ◽  
Vol 92 (9) ◽  
pp. 094901
Author(s):  
Yuanyuan Zhou ◽  
Chunhua Li ◽  
David Broido ◽  
Li Shi
MRS Bulletin ◽  
2001 ◽  
Vol 26 (6) ◽  
pp. 458-463 ◽  
Author(s):  
Jitendra S. Goela ◽  
Nathaniel E. Brese ◽  
Michael A. Pickering ◽  
John E. Graebner

Chemical vapor deposition (CVD) is an attractive method for producing bulk and thin-film materials for a variety of applications. In this method, gaseous reagents condense onto a substrate and then react to produce solid materials. The materials produced by CVD are theoretically dense, highly pure, and have other superior properties.


2018 ◽  
Vol 193 (3-4) ◽  
pp. 380-386 ◽  
Author(s):  
J. P. Allmaras ◽  
A. G. Kozorezov ◽  
A. D. Beyer ◽  
F. Marsili ◽  
R. M. Briggs ◽  
...  

2018 ◽  
Vol 334 ◽  
pp. 233-242 ◽  
Author(s):  
Alireza Moridi ◽  
Liangchi Zhang ◽  
Weidong Liu ◽  
Steven Duvall ◽  
Andrew Brawley ◽  
...  

2012 ◽  
Vol 2012.65 (0) ◽  
pp. 139-140
Author(s):  
Harutoshi HAGINO ◽  
Yosuke KAWAHARA ◽  
Aimi GOTO ◽  
Toru HIWADA ◽  
Koji Miyazaki

Author(s):  
Dachen Chu ◽  
Maxat Touzelbaev ◽  
Kenneth E. Goodson ◽  
Sergey Babin ◽  
R. Fabian Pease

1998 ◽  
Author(s):  
Albert Feldman ◽  
Naira M. Balzaretti ◽  
Arthur H. Guenther

Author(s):  
Z. Buliński ◽  
S. Pawlak ◽  
T. Krysiński ◽  
W. Adamczyk ◽  
R. Białecki

Purpose: The purpose of the present study was to demonstrate the procedure for determining the thermal conductivity of a solid material with relatively high thermal conductivity, using an original self-designed apparatus. Design/methodology/approach: The thermal conductivity measurements have been performed according to the ASTM D5470 standard. The thermal conductivity was calculated from the recorded temperature values in steady-state heat transfer conditions and determined heat flux. Findings: It has been found from the obtained experimental results that the applied standard test method, which was initially introduced for thermal conductivity measurements of thermal interface materials (TIMs), is also suitable for materials with high thermal conductivity, giving reliable results. Research limitations/implications: The ASTM D5470 standard test method for measurement of thermal conductivity usually gives poor results for high conductive materials having thermal conductivity above 100 W/mK, due to problems with measuring heat flux and temperature drop across the investigated sample with reasonably high accuracy. Practical implications: The results obtained for the tested material show that the presented standard test method can also be used for materials with high thermal conductivity, which is of importance either for the industrial or laboratory applications. Originality/value: The thermal conductivity measurements have been carried out using an original self-designed apparatus, which was developed for testing broad range of engineering materials with high accuracy.


2011 ◽  
Vol 357 (15) ◽  
pp. 2960-2965 ◽  
Author(s):  
M.L. Bauer ◽  
C.M. Bauer ◽  
M.C. Fish ◽  
R.E. Matthews ◽  
G.T. Garner ◽  
...  

1998 ◽  
Vol 545 ◽  
Author(s):  
T. Borca-Tasciuc ◽  
D. Song ◽  
J. L. Liu ◽  
G. Chen ◽  
K. L. Wang ◽  
...  

AbstractExperimental evidence for a significant thermal conductivity reduction have been reported in recent years for GaAs/AlAs, Si/Ge, and Bi 2Te3/Sb2Te3 superlattices. In this work, we present preliminary experimental results on the reduction of the in-plane and cross-plane thermal conductivity for a symmetric Si/Ge superlattice. A differential 2-wire 3ω method is developed to perform the anisotropic thermal conductivity measurements. In this technique, a patterned heater with a width much larger than the film thickness yields the cross-plane thermal conductivity of the film. The in-plane thin film thermal conductivity is inferred from the temperature rise of a narrow width heater that can create more heat spreading in the in-plane direction of the thin film. A differential method to measure the temperature drop across the film is employed in order to increase the accuracy of the measurement.


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