scholarly journals Publisher's Note: “Hard x-ray photoemission study on strain effect in LaNiO3 thin films” [Appl. Phys Lett. 118, 161601 (2021)]

2021 ◽  
Vol 118 (23) ◽  
pp. 239902
Author(s):  
K. Yamagami ◽  
K. Ikeda ◽  
A. Hariki ◽  
Y. Zhang ◽  
A. Yasui ◽  
...  
2021 ◽  
Vol 118 (16) ◽  
pp. 161601
Author(s):  
K. Yamagami ◽  
K. Ikeda ◽  
A. Hariki ◽  
Y. Zhang ◽  
A. Yasui ◽  
...  

2002 ◽  
Vol 11 (12) ◽  
pp. 1300-1302 ◽  
Author(s):  
Wang Shu-Fang ◽  
Zhou Yue-Liang ◽  
Zhu Ya-Bin ◽  
Zhang Qin ◽  
Xie Kan ◽  
...  
Keyword(s):  
X Ray ◽  

2003 ◽  
Vol 1 (2) ◽  
pp. 372-377 ◽  
Author(s):  
F. Mirabella ◽  
B. A. Parkinson ◽  
J. Ghijsen

1983 ◽  
Vol 28 (2) ◽  
pp. 1154-1157 ◽  
Author(s):  
E. Paparazzo ◽  
J. L. Dormann ◽  
D. Fiorani
Keyword(s):  
X Ray ◽  

1999 ◽  
Vol 101-103 ◽  
pp. 501-505 ◽  
Author(s):  
Y Saito ◽  
K Yamaki ◽  
S Fujimori ◽  
S Suzuki ◽  
S Sato
Keyword(s):  
X Ray ◽  

2005 ◽  
Vol 144-147 ◽  
pp. 557-559 ◽  
Author(s):  
K. Horiba ◽  
M. Taguchi ◽  
N. Kamakura ◽  
K. Yamamoto ◽  
A. Chainani ◽  
...  
Keyword(s):  
X Ray ◽  

Author(s):  
R. M. Anderson

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.


Author(s):  
C. W. Price ◽  
E. F. Lindsey

Thickness measurements of thin films are performed by both energy-dispersive x-ray spectroscopy (EDS) and x-ray fluorescence (XRF). XRF can measure thicker films than EDS, and XRF measurements also have somewhat greater precision than EDS measurements. However, small components with curved or irregular shapes that are used for various applications in the the Inertial Confinement Fusion program at LLNL present geometrical problems that are not conducive to XRF analyses but may have only a minimal effect on EDS analyses. This work describes the development of an EDS technique to measure the thickness of electroless nickel deposits on gold substrates. Although elaborate correction techniques have been developed for thin-film measurements by x-ray analysis, the thickness of electroless nickel films can be dependent on the plating bath used. Therefore, standard calibration curves were established by correlating EDS data with thickness measurements that were obtained by contact profilometry.


Author(s):  
D. R. Liu ◽  
S. S. Shinozaki ◽  
R. J. Baird

The epitaxially grown (GaAs)Ge thin film has been arousing much interest because it is one of metastable alloys of III-V compound semiconductors with germanium and a possible candidate in optoelectronic applications. It is important to be able to accurately determine the composition of the film, particularly whether or not the GaAs component is in stoichiometry, but x-ray energy dispersive analysis (EDS) cannot meet this need. The thickness of the film is usually about 0.5-1.5 μm. If Kα peaks are used for quantification, the accelerating voltage must be more than 10 kV in order for these peaks to be excited. Under this voltage, the generation depth of x-ray photons approaches 1 μm, as evidenced by a Monte Carlo simulation and actual x-ray intensity measurement as discussed below. If a lower voltage is used to reduce the generation depth, their L peaks have to be used. But these L peaks actually are merged as one big hump simply because the atomic numbers of these three elements are relatively small and close together, and the EDS energy resolution is limited.


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