Mechanical properties of nanoporous organo silicate glass films for the use in integrated circuits interconnects

2020 ◽  
Author(s):  
Ivan Ovchinnikov ◽  
Georgiy Orlov ◽  
Dmitriy Seregin ◽  
Alexey Vishnevskiy ◽  
Konstantin Vorotilov ◽  
...  
1997 ◽  
Vol 3 (S2) ◽  
pp. 1281-1282
Author(s):  
A.V. Zagrebelny ◽  
C.B. Carter

It has been long recognized that the understanding of mechanical properties of thin films on substrates requires an understanding of the stresses in the film structures as well as a knowledge of mechanisms by which thin films deform. It has also been shown that these stresses may compromise the performance of integrated circuits, magnetic media, etc. The presence of residual and thermal stresses between the matrix and intergranular films in structural multiphase ceramics is the most common mechanism of failure that often causes deformation and fractureIn this paper, the effect of residual stress on mechanical properties of silicate-glass films on single-crystal α-Al2O3 substrates has been studied with AFM with the emphasis on the changes in surface morphology associated with the film strain and relaxation. The deformation of thin layers of glass on crystalline materials has also been examined using newly developed experimental methods for nanomechanical testing.


1997 ◽  
Vol 505 ◽  
Author(s):  
Andrey V. Zagrebelny ◽  
C. Barry Carter

ABSTRACTThe deformation of thin layers of glass on crystalline materials has been examined using newly developed experimental methods for nanomechanical testing. Continuous films of anorthite (CaAl2Si2O8), celsian (BaAl2Si2O8), and monticellite (CaMgSiO4) were deposited onto A12O3 surfaces by pulsed-laser deposition (PLD). Mechanical properties such as Young's modulus and hardness were probed with a high-resolution depth-sensing indentation instrument. Nanomechanical testing, combined with AFM in-situ imaging of the deformed regions, allowed force-displacement measurements and imaging of the same regions of the specimen before and immediately after indentation. Emphasis has been placed on examining how changes in the glass composition, residual stress introduced into the films, effect of film's heat-treatment, and the effect of substrate crystallographic orientation will affect the mechanical properties of silicate-glass films.


Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.


1999 ◽  
Vol 86 (5) ◽  
pp. 2393-2396 ◽  
Author(s):  
Makoto Nakanishi ◽  
Okihiro Sugihara ◽  
Naomichi Okamoto ◽  
Hisashi Fujimura ◽  
Chikara Egami

1999 ◽  
Vol 82 (7) ◽  
pp. 1803-1808 ◽  
Author(s):  
Andrey V. Zagrebelny ◽  
Erica T. Lilleodden ◽  
William W. Gerberich ◽  
C. Barry Carter
Keyword(s):  

2021 ◽  
Author(s):  
Chao Chen ◽  
Qingong Zhu ◽  
Huanping Wang ◽  
Feifei Huang ◽  
Qinghua Yang ◽  
...  

Abstract As is well known, silicate glass has a stable glass-forming region and mature drawing processes into fibers. In this study, to obtain enhanced mechanical properties, glasses with a composition of SiO2-Al2O3-MgO-CaO-B2O3-Fe2O3 were synthesized using TiO2 and CeO2. When the amount of TiO2 and CeO2 is less than 2 wt%, the mechanical properties increase with increases in the TiO2 and CeO2. However, as the amount of TiO2 and CeO2 increases from 2 to 3.5 wt%, the mechanical properties decrease. Co-doping with 1 wt% TiO2 and 1 wt% CeO2 was found to be the optimum approach, with a density, bending strength, compression strength, and compression modulus of 2.626 g/cm3, 108.36 MPa, 240.18 MPa, and 115.03 GPa, respectively. The optical band gap and Raman spectroscopy proved that, as long as the content of oxygen bonds reaches the maximum level, a kind of best structural stability and mechanical properties will be achieved. Hence, this type of high-strength silicate glass can be used in optical fibers for military defense, wind power generation, and transportation.


2000 ◽  
Vol 612 ◽  
Author(s):  
Stefan P. Hau-Riege ◽  
Carl V. Thompson

AbstractNew low-dielectric-constant inter-level dielectrics are being investigated as alternatives to SiO2 for future integrated circuits. In general, these materials have very different mechanical properties from SiO2. In the standard model, electromigration-induced stress evolution caused by changes in the number of available lattice sites in interconnects is described by an effective elastic modulus, B. Finite element calculations have been carried out to obtain B as a function of differences in the modulus, E, of interlevel dielectrics, for several stress-free homogeneous dilational strain configurations, for several line aspect ratios, and for different metallization schemes. In contradiction to earlier models, we find that for Cu-based metallization schemes with liners, a decrease in E by nearly two orders of magnitude has a relatively small effect on B, changing it by less than a factor of 2. However, B, and therefore the reliability of Cu interconnects can be strongly dependent on the modulus and thickness of the liner material.


1997 ◽  
Vol 3 (S2) ◽  
pp. 1269-1270
Author(s):  
A. V. Zagrebelny ◽  
C. B. Carter

In polycrystalline liquid-phase sintered (LPS) alumina ceramics, intergranular phases have proved to have a profound effect on mechanical properties such as strength, toughness, plastic deformation, and high-temperature creep. The presence of such intergranular phases, can also influence the kinetics of many processes including sintering, grain growth, and phase transformations. As a result, the key to optimizing the performance of a ceramic material is frequently related to optimizing the properties of these grain boundary regions. In order to understand the interactions between the glass layer and the crystalline grains at a fundamental level, the amorphous material must be placed in contact with the crystalline ceramic as a thin film in a controlled manner. Preparation of such a glass phase in the thin-film geometry has also prompted the use of nontraditional mechanicaltesting techniques.In the present study, interfaces between silicate glass and single-crystal α-Al2O3 have been studied using AFM and nanoindentation.


1996 ◽  
Vol 458 ◽  
Author(s):  
Andrey V. Zagrebelny ◽  
Erica T. Lilleodden ◽  
C. Barry Carter

ABSTRACTInterfaces between glass and crystalline grains have been examined using a thin-film geometry which allows the use of newly developed experimental methods for micromechanical testing of interfaces. In this approach, continuous films of thicknesses ranging 100–200 nm of anorthite (CaAl2Si2O8), celsian (BaAl2Si2O8), and monticellite (CaMgSiO4) are deposited onto single-crystal Al2O3 (α-structure) surfaces of different crystallographic orientations by pulsed-laser deposition (PLD).Mechanical properties such as hardness, stiffness, and reduced Young's modulus were probed with a newly developed high-resolution depth-sensing indentation instrument. Emphasis has been placed on examining how changes in the glass composition will affect the mechanical properties of the single-crystal Al2O3/silicate-glass interfaces. The indentation data obtained from these experiments correlate directly to the morphology of the deformed regions imaged with atomic force microscopy (AFM). Nanomechanical tests combined with AFM imaging of the deformed regions allow force-displacement measurements and in-situ imaging of the same regions of the specimen before and immediately after indentation. This new technique eliminates the uncertainty of locating the indenter after unloading.


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