Nonradiative recombination in InGaAsP/InP light sources causing light emitting diode output saturation and strong laser‐threshold‐current temperature sensitivity

1981 ◽  
Vol 38 (4) ◽  
pp. 193-195 ◽  
Author(s):  
T. Uji ◽  
K. Iwamoto ◽  
R. Lang
Keyword(s):  
Temperature Sensitivity ◽  
Light Emitting Diode ◽  
Threshold Current ◽  
Light Sources ◽  
Nonradiative Recombination ◽  
Light Emitting ◽  
Laser Threshold ◽  
Strong Laser

Electrically driven single microribbon based near-infrared exciton-polariton light-emitting diode

CrystEngComm ◽  
2021 ◽  
Author(s):  
Mingming Jiang ◽  
Fupeng Zhang ◽  
Kai Tang ◽  
Peng Wan ◽  
Caixia Kan
Keyword(s):  
High Performance ◽  
Near Infrared ◽  
Light Emitting Diodes ◽  
Light Emitting Diode ◽  
Light Sources ◽  
Coherent Light ◽  
Light Emitting ◽  
Exciton Polaritons ◽  
Laser Devices

Achieving electrically-driven exciton-polaritons has drawn substantial attention toward developing ultralow-threshold coherent light sources, containing polariton laser devices and high-performance light-emitting diodes (LEDs). In this work, we demonstrate an electrically driven...

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

In-Use Photostability Practice and Regulatory Evaluation for Pharmaceutical Products in an Age of Light-Emitting Diode Light Sources

2019 ◽  
Vol 108 (3) ◽  
pp. 1172-1176 ◽  
Author(s):  
Leonardo R. Allain ◽  
Brittany C. Pierce ◽  
W. Peter Wuelfing ◽  
Allen C. Templeton ◽  
Roy Helmy
Keyword(s):  
Light Emitting Diode ◽  
Pharmaceutical Products ◽  
Light Sources ◽  
Light Emitting ◽  
Regulatory Evaluation

Manufacture and Evaluation of Light Emitting Diode Package Substrate Using Flexible Printed Circuit Board

2015 ◽  
Vol 15 (10) ◽  
pp. 7578-7581
Author(s):  
Jung-Kab Park ◽  
Jin-Ha Shin ◽  
Mun-Gi Jung ◽  
Tomabechi Shigehisa ◽  
Hwa-Sun Park ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Light Emitting Diode ◽  
Thermal Conductance ◽  
Polyimide Film ◽  
Luminous Efficiency ◽  
Circuit Board ◽  
Light Sources ◽  
Thermal Shock Test ◽  
Light Emitting ◽  
Au Electrode

Unlike other light sources such as fluorescent lamps and incandescent bulbs, light-emitting diodes (LED) convert 70∼80% of energy into heat. If the heat produced an LED chip is not effectively released, its luminous efficiency and lifespan are reduced. Therefore, as a method effectively release heat, an LED PKG substrate containing a heat-releasing material with excellent thermal conductance was fabricated, and its thermal resistance and luminous efficiency were analyzed. In this experiment, a thin polyimide film with excellent ductility was used to fabricate the LED PKG substrate. A 35-μm-thick Cu foil with excellent thermal conductance was subjected to high temperature and pressure and attached to both sides of the polyimide film. By electroplating Ag or Au, which has excellent thermal conductance, for us as the electrode and heat-releasing material, LED PKG substrate was fabricated with a thickness of approximately 170 μm. (−40 °C → RT → 120 °C). The results revealed that the LED PKG substrate having a Ag electrode with excellent thermal conductance had an excellent thermal resistance of approximately 4.2 °C/W (Au electrode: 5.6 °C/W). The luminous flux after 100 cycles in the thermal shock test was reduced by approximately 0.09% (Au electrode: 2.77%), indicating that the LED PKG substrate had excellent thermal resistance without any mechanical and material defects in a rapid-temperature-changing environment. The advantages and excellent thermal resistance can be exploited in cellular phones and LCD panels, and heat-releasing problems in thin panels be solved.

Research on the Nonlinearity of Photoelectric Pyrometer Based on Light-Emitting Diode Light Sources

2010 ◽  
Vol 30 (8) ◽  
pp. 2412-2416 ◽  
Author(s):  
董伟 Dong Wei ◽  
原遵东 Yuan Zundong ◽  
卢小丰 Lu Xiaofeng
Keyword(s):  
Light Emitting Diode ◽  
Light Sources ◽  
Light Emitting ◽  
Photoelectric Pyrometer

Light-emitting diodes as light sources for spectroscopy: Sensitivity to temperature

2017 ◽  
Vol 25 (6) ◽  
pp. 416-422 ◽  
Author(s):  
Clinton J Hayes ◽  
Kerry B Walsh ◽  
Colin V Greensill
Keyword(s):  
Ambient Temperature ◽  
Near Infrared ◽  
Light Emitting Diodes ◽  
Light Emitting Diode ◽  
Junction Temperature ◽  
Effect Of Temperature ◽  
Light Sources ◽  
Spectral Variation ◽  
Light Emitting ◽  
Full Intensity

Understanding of light-emitting diode lamp behaviour is essential to support the use of these devices as illumination sources in near infrared spectroscopy. Spectral variation in light-emitting diode peak output (680, 700, 720, 735, 760, 780, 850, 880 and 940 nm) was assessed over time from power up and with variation in environmental temperature. Initial light-emitting diode power up to full intensity occurred within a measurement cycle (12 ms), then intensity decreased exponentially over approximately 6 min, a result ascribed to an increase in junction temperature as current is passed through the light-emitting diode. Some light-emitting diodes displayed start-up output characteristics on their first use, indicating the need for a short light-emitting diode ‘burn in’ period, which was less than 24 h in all cases. Increasing the ambient temperature produced a logarithmic decrease in overall intensity of the light-emitting diodes and a linear shift to longer wavelength of the peak emission. This behaviour is consistent with the observed decrease in the IAD Index (absorbance difference between 670 nm and 720 nm, A670–A720) with increased ambient temperature, as measured by an instrument utilising light-emitting diode illumination (DA Meter). Instruments using light-emitting diodes should be designed to avoid or accommodate the effect of temperature. If accommodating temperature, as light-emitting diode manufacturer specifications are broad, characterisation is recommended.

scholarly journals Illuminance and Starting Distance of the Far Field of LED-Array Luminaire Operated at Short Working Distance

Crystals ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 360
Author(s):  
Ching-Cherng Sun ◽  
Yi-Syuan Lin ◽  
Tsung-Hsun Yang ◽  
Shih-Kang Lin ◽  
Xuan-Hao Lee ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
Light Sources ◽  
Far Field ◽  
Extended Source ◽  
Light Emitting ◽  
High Uniformity ◽  
Led Array ◽  
Working Distance ◽  
Divergent Angle ◽  
Short Working

A luminaire with a light-emitting diode (LED) array can provide hotspot illumination in a short range. Therefore, a design of a luminaire with the largest central illuminance (LCI) and a high uniformity is warranted. In this paper, we present a study of illuminance variation with respect to the distance of an illumination target of a luminaire with LED array. The emission property of the luminous intensity is characterized by the cosine power law or the divergent angle of full width at half maximum (FWHM). A real LED module is designed to create the simulation for different luminaire types. The occurrence of the LCI and the far-field region are observed. Our results demonstrate that the LCI distance remains shorter than the starting distance of the far field (SDFF). To simplify the simulation, we propose the replacement of the real LED module with a point or flat-extended source. Such light sources must be equipped with the specific cosine power factor corresponding to the divergent angle of the FWHM of the LED module. These light sources are acceptable for describing illumination characteristics, including the SDFF. Our results may facilitate the design of LED-array luminaires operated at short working distances, such as reading lighting or illumination in microscopes.

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