High‐resolution optoacoustic spectroscopy of rare‐earth oxide powders

1979 ◽  
Vol 35 (11) ◽  
pp. 843-845 ◽  
Author(s):  
A. C. Tam ◽  
C. K. N. Patel
2008 ◽  
Vol 403 ◽  
pp. 111-114 ◽  
Author(s):  
Kei Asakoshi ◽  
Junichi Tatami ◽  
Katsutoshi Komeya ◽  
Takeshi Meguro ◽  
Masahiro Yokouchi

β-SiAlON powder was used as a raw powder to fabricate α/β-SiAlON composite ceramics with different rare earth elements. The phases present in the sample fabricated from -SiAlON, α-Si3N4, AlN, and rare earth oxide powders were - and -SiAlONs. The composition was dependent on the chemical composition and firing profile. The sample obtained by adding Yb2O3 had a high -SiAlON content. The /-SiAlON composite ceramics had high densit. Their microstructures depended on the used metal oxides, namely, the addition of Nd2O3 and CaCO3 resulted in the elongation of the -SiAlON grains. The bending strength, fracture toughness, and hardness were influenced by the -SiAlON content, amount of elongated grains, and density of the sample.


2002 ◽  
Vol 28 (5) ◽  
pp. 641-646 ◽  
Author(s):  
Junji Shibata ◽  
Katsuya Fujii ◽  
Hideki Yamamoto

2021 ◽  
Vol 13 (3) ◽  
pp. 168781402110077
Author(s):  
Chao Du ◽  
Cuirong Liu ◽  
Xu Yin ◽  
Haocheng Zhao

Herein, we synthesized a new polyethylene glycol (PEG)-based solid polymer electrolyte containing a rare earth oxide, CeO2, using mechanical metallurgy to prepare an encapsulation bonding material for MEMS. The effects of CeO2 content (0–15 wt.%) on the anodic bonding properties of the composites were investigated. Samples were analyzed and characterized by alternating current impedance spectroscopy, X-ray diffraction, scanning electron microscopy, differential scanning calorimetry, tensile strength tests, and anodic bonding experiments. CeO2 reduced the crystallinity of the material, promoted ion migration, increased the conductivity, increased the peak current of the bonding process, and increased the tensile strength. The maximum bonding efficiency and optimal bonding layer were obtained at 8 wt% CeO2. This study expands the applications of solid polymer electrolytes as encapsulation bonding materials.


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