Thin film coating of copper nanoparticles with DC magnetron sputtering via physical vapor deposition

2019 ◽  
Author(s):  
Muhammad Rosli Abdullah ◽  
Noor Hasmiza Harun ◽  
S. Noorjannah Ibrahim ◽  
Azimah Abdul Wahab
2012 ◽  
Vol 1 (1) ◽  
pp. 46 ◽  
Author(s):  
Amir Mahyar Khorasani ◽  
Mohammad Reza Solymany yazdi ◽  
Mehdi Faraji ◽  
Alex Kootsookos

Thin-film coating plays a prominent role on the manufacture of many industrial devices. Coating can increase material performance due to the deposition process. Having adequate and precise model that can predict the hardness of PVD and CVD processes is so helpful for manufacturers and engineers to choose suitable parameters in order to obtain the best hardness and decreasing cost and time of industrial productions. This paper proposes the estimation of hardness of titanium thin-film layers as protective industrial tools by using multi-layer perceptron (MLP) neural network. Based on the experimental data that was obtained during the process of chemical vapor deposition (CVD) and physical vapor deposition (PVD), the modeling of the coating variables for predicting hardness of titanium thin-film layers, is performed. Then, the obtained results are experimentally verified and very accurate outcomes had been attained.


2014 ◽  
Vol 11 (3) ◽  
pp. 128-136
Author(s):  
Nathaniel Dahan ◽  
Nick Donaldson ◽  
Stephen Taylor ◽  
Nuno Sereno

For short term applications (less than three years), it may be possible to replace traditional long term packaging materials such as titanium with a biocompatible polymer such as PEEK. This paper investigates the use of commercially available thin films to decrease the water vapor permeation rate through the walls of a PEEK package. It was found that most physical vapor deposition (PVD) and plasma assisted chemical vapor deposition (PaCVD) coatings tested did not provide a significant improvement in lifetime, due to the porosity of the films produced. This is mostly linked to the morphology of the films (i.e., growth in columns which are poorly bonded together, creating a porous structure) and is exacerbated by the high surface roughness of the machined substrates. Applying a lacquer before coating reduces this effect significantly, and we found that the time constant of our coated packages was improved by a factor of 2.3. Based on the findings of our group's previous work and this paper, the maximum achievable lifetime of PEEK packages with a thin film coating and desiccant is presented. As an example, a coated cylindrical PEEK package (using atomic layer deposition, ALD) with a uniform wall thickness of 2 mm, an internal cavity size of 1.5 cm3, filled with 20% of desiccant, has a lifetime of 18.8 mo (27.2 mo with 30% of desiccant). This would be sufficient for a range of applications and provide a cheaper and more versatile packaging alternative to traditional packages.


2003 ◽  
Vol 763 ◽  
Author(s):  
Alvin D. Compaan

AbstractAlthough the deposition over large areas of polycrystalline thin-film semiconductors such as CdTe is possible by a variety of methods including close spaced sublimation, vapor transport deposition, physical vapor deposition, organometallic chemical vapor deposition, and electrodeposition, the use of a plasma-based method such as magnetron sputtering can have significant advantages. In this paper I review recent results from our group in the fabrication of CdS/CdTe cells using rf magnetron sputtering and discuss some of the advantages that appear possible from the use of sputtering methods in this class of materials. Some of these advantages are particularly relevant as the polycrystalline thin-film community address issues related to the challenges of fabricating high efficiency tandem cells with efficiencies over 25%. Recently we have achieved: improvements in sputtered cell performance with cells based on commercial SnO2:F as well as on substrates with our own sputtered ZnO:Al, progress in the use of reactive sputtering for the deposition of oxygen alloys of CdS and N-doped layers of ZnTe, and progress in the sputtering of wider and narrower bandgap alloys of CdTe with Zn, Mn, and Hg. Details of the sputtering process and some of the recent achievements are discussed below.


Author(s):  
Benjamin Garrett ◽  
Mathew Zablocki ◽  
Mark S. Mirotznik ◽  
Nicholas Hudak ◽  
Ahmed S. Sharkawy ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document