Cu-Cu low temperature bonding based on lead-free solder with graphene interlayer

2019 ◽  
Vol 115 (12) ◽  
pp. 122102 ◽  
Author(s):  
Wenhua Yang ◽  
Jie Zhou ◽  
Xinyuan Jiang ◽  
Ximing Ye ◽  
Xiaofeng Xuan ◽  
...  
Keyword(s):  
Low Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Low Temperature Bonding

Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Guang Ren ◽  
Maurice Collins
Keyword(s):  
Low Temperature ◽  
Solder Alloy ◽  
Creep Behaviour ◽  
Lead Free ◽  
Coefficient Of Determination ◽  
Secondary Creep ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Free Solder

Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys. Design/methodology/approach An in-house compressive test rig was developed to perform creep tests under stresses of 20–40 MPa and temperature range 25°C–75 °C. Dorn power law and Garofalo hyperbolic sine law were used to model the secondary creep rate. Findings High coefficient of determination R2 of 0.99 is achieved for both the models. It was found that the activation energy of Sn–8Zn–3Bi solder alloy can be significantly increased with addition of Sb, by 60% to 90 kJ/mol approximately, whereas the secondary creep exponent falls in the range 3–7. Improved creep resistance is attributed to solid solution strengthening introduced by micro-alloying. Creep mechanisms that govern the deformation of these newly developed lead-free solder alloys have also been proposed. Originality/value The findings are expected to fill the gap of knowledge on creep behaviour of these newly developed solder alloys, which are possible alternatives as lead-free interconnecting material in low temperature electronic assembly.

The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method

2008 ◽  
Vol 130 (1) ◽  
Author(s):  
Wen-Ren Jong ◽  
Hsin-Chun Tsai ◽  
Hsiu-Tao Chang ◽  
Shu-Hui Peng
Keyword(s):  
Low Temperature ◽  
Shear Strain ◽  
Solder Joints ◽  
Strain Range ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Free Solder ◽  
Plastic Creep

In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies are investigated by Taguchi method. The orthogonal arrays of L16 is applied to examine the shear strain effects of solder joints under five temperature loading parameters of the temperature ramp rate, the high and low temperature dwells, and the dwell time of both high and low temperatures by means of three simulated analyses of creep, plastic, and plastic-creep behavior on the WLCSP assemblies. It is found that the temperature dwell is the most significant factor on the effects of shear strain range from these analyses. The effect of high temperature dwell on the shear strain range is larger than that of low temperature dwell in creep analysis, while the effect of high temperature dwell on the shear strain range is smaller than that of low temperature dwell in both plastic and plastic-creep analyses.

Effects of Bi and Pb on oxidation in humidity for low-temperature lead-free solder systems

2006 ◽  
Vol 35 (1) ◽  
pp. 41-47 ◽  
Author(s):  
Keun-Soo Kim ◽  
Toshinori Matsuura ◽  
Katsuaki Suganuma
Keyword(s):  
Low Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Evaluation of Low Temperature Lead-Free Solder Using Corrosion Tests

2003 ◽  
Vol 6 (5) ◽  
pp. 400-405
Author(s):  
Hirokazu TANAKA ◽  
Kishichi SASAKI ◽  
Yoshihisa KATO ◽  
Tsutomu TSUKUI
Keyword(s):  
Low Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Corrosion Tests ◽  
Free Solder
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