Investigation of piezo-capacitance and piezo-resistance properties of solid silicone rubber-conductive carbon black composites

2019 ◽  
Author(s):  
B. S. Manohar Shankar ◽  
S. M. Kulkarni
Keyword(s):  
Carbon Black ◽  
Silicone Rubber ◽  
Conductive Carbon Black

scholarly journals Synthesis of a grape-like conductive carbon black/Ag hybrid as the conductive filler for soft silicone rubber

RSC Advances ◽  
2022 ◽  
Vol 12 (2) ◽  
pp. 1184-1193
Author(s):  
Yanli Dou ◽  
Haijing Gu ◽  
Shixiang Sun ◽  
Weiguo Yao ◽  
Dongbo Guan
Keyword(s):  
Carbon Black ◽  
Silicone Rubber ◽  
Conductive Filler ◽  
Conductive Carbon Black ◽  
Fabrication Procedure

Schematic of the fabrication procedure of SMCB@Ag with the grape-like structure.

Compressive Deformation and Energy Absorption Characteristics of Conductive Carbon Black Reinforced Microcellular EPDM Vulcanizates

2005 ◽  
Vol 24 (4) ◽  
pp. 209-222 ◽  
Author(s):  
S.P. Mahapatra ◽  
D.K. Tripathy
Keyword(s):  
Carbon Black ◽  
Compressive Stress ◽  
Energy Absorption ◽  
Filler Loading ◽  
Maximum Efficiency ◽  
Stress Strain ◽  
Blowing Agent ◽  
Compression Set ◽  
Rate Dependent ◽  
Conductive Carbon Black

Compressive stress-strain properties of unfilled and conductive carbon black (VulcanXC 72) filled oil extended EPDM (keltan 7341A) microcellular vulcanizates were studied as a function of blowing agent (density) and filler loading. With decrease in density, the compressive stress-strain curves for microcellular vulcanizates behaved differently from those of solid vulcanizates. The compressive stress-strain properties were found to be strain rate dependent. The log-log plots of relative density of the microcellular vulcanizates showed a fairly linear correlation with the relative modulus. The compression set at a constant stress increased with decrease in density. The efficiency of energy absorption E, was also studied as a function of filler and blowing agent loading. From the compressive stress-strain plots the efficiency E and the ideality parameter I, were evaluated. These parameters were plotted against stress to obtain maximum efficiency and the maximum ideality region, which will make these materials suitable for cushioning and packaging applications in electronic devices.

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