scholarly journals 3D printed high performance strain sensors for high temperature applications

2018 ◽  
Vol 123 (2) ◽  
pp. 024501 ◽  
Author(s):  
Md Taibur Rahman ◽  
Russell Moser ◽  
Hussein M. Zbib ◽  
C. V. Ramana ◽  
Rahul Panat
Keyword(s):  
High Temperature ◽  
High Performance ◽  
Strain Sensors ◽  
3D Printed ◽  
Temperature Applications

A Material Genomic Design of Advanced High Performance, Non-Corroding Steels for Ambient and High Temperature Applications

2014 ◽  
Vol 783-786 ◽  
pp. 1201-1206
Author(s):  
Qi Lu ◽  
Wei Xu ◽  
Sybrand van der Zwaag
Keyword(s):  
High Temperature ◽  
High Performance ◽  
High Strength ◽  
Algorithm Optimization ◽  
Maraging Stainless Steel ◽  
Materials Genome ◽  
Optimization Routine ◽  
Materials Genome Initiative ◽  
Creep Resistant Steels ◽  
Temperature Applications

This work presents an artificial intelligence based design of a series of novel advanced high performance steels for ambient and high temperature applications, following the principle of the materials genome initiative, using an integrated thermodynamics/kinetics based model in combination with a genetic algorithm optimization routine. Novel steel compositions and associated key heat treatment parameters are designed both for applications at the room temperature (ultra-high strength maraging stainless steel) and at high temperatures (ferritic, martensitic and austenitic creep resistant steels). The strength of existing high end alloys of aforementioned four types are calculated according to the corresponding design criteria. The model validation studies suggest that the newly designed alloys have great potential in outperforming existing grades.

An Ultra-Low Noise Instrumentation Amplifer Designed for High Temperature Applications

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000082-000086
Author(s):  
Jeff Watson ◽  
Gustavo Castro
Keyword(s):  
High Temperature ◽  
High Performance ◽  
Low Noise ◽  
Silicon On Insulator ◽  
Instrumentation Amplifier ◽  
Leakage Currents ◽  
Comprehensive Reliability ◽  
High Temperature Operation ◽  
Temperature Applications

This paper discusses a very low noise instrumentation amplifier designed specifically for high temperature applications. The device uses a proprietary silicon-on-insulator process that minimizes parasitic leakage currents at elevated temperature. Variance in device parameters are managed to maintain high performance over a wide temperature range. Layout and packaging considerations that would affect long term reliability are addressed. The amplifier is well characterized above 200°C and attains much higher performance than amplifiers not optimized for high temperature operation. Comprehensive reliability testing over temperature has been completed.

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

2016 ◽  
Vol 2016 (HiTEC) ◽  
pp. 000149-000158
Author(s):  
Xin Zhao ◽  
Haotao Ke ◽  
Yifan Jiang ◽  
Adam Morgan ◽  
Yang Xu ◽  
...  
Keyword(s):  
High Temperature ◽  
High Voltage ◽  
High Performance ◽  
Power Module ◽  
Module Design ◽  
Power Modules ◽  
Operational Temperature ◽  
Full Power ◽  
Temperature Applications

Abstract This paper presents design, fabrication and characterization details of a 10kV power module package for >200°C ambient temperature applications. Electrical simulations were performed to confirm the module design, and that the electric field distribution throughout the module did not exceed dielectric capabilities of components and materials. A suitable copper etching process was demonstrated for DBC layout, and a high melting point Sn/Pb/Ag solder reflow process was developed for device and component attachment. To monitor the operational temperature of the module, a thermistor was integrated onto the substrate. A new silicone gel, having a working temperature up to 210°C, was evaluated and selected for encapsulation and, of great importance, for passivation of high voltage (10kV) SiC dies. An additive manufacturing ‘Design Process’ was developed and applied to printing the housings, molds, and test fixtures. Also, cleaning processes were evaluated for every step in the fabrication process. To verify performance of the modules, mechanical dies were mounted on the substrates, and a high temperature testing setup built to characterize the modules at high temperature. Measurements indicated that the module can operate up to 12kV within 25°C to 225°C, with less than 0.1 μA leakage current. The packaging was used for full-power characterization of developmental 10kV SiC diodes, and proved that the power module packaging satisfied all requirements for high voltage and high temperature applications. This work successfully validated the processes for creating high voltage (>10 kV) and high temperature (>200°C) power modules.

Sign in / Sign up

Export Citation Format

Share Document