Particle size-induced transition between surface segregation and bulk aggregation in a thin film of athermal polymer-nanoparticle blends

2017 ◽  
Vol 146 (1) ◽  
pp. 014904 ◽  
Author(s):  
Chih-Yu Teng ◽  
Yu-Jane Sheng ◽  
Heng-Kwong Tsao
Keyword(s):  
Thin Film ◽  
Particle Size ◽  
Surface Segregation ◽  
Polymer Nanoparticle

Dip Coating From Density Mismatching Mixture

2021 ◽  
Author(s):  
Bashir Khoda ◽  
AMM Nazmul Ahsan ◽  
SM Abu Shovon
Keyword(s):  
Thin Film ◽  
Particle Size ◽  
Volume Fraction ◽  
Steel Wire ◽  
Cost Effective ◽  
Dip Coating ◽  
Solid Loading ◽  
Heterogeneous Mixture ◽  
Inorganic Particles ◽  
Inorganic Particle

Abstract Solid transfer technology from mixtures is gaining ever-increasing attention from materials scientists and production engineers due to their high potential in near net-shaped production of cost-effective engineering components. Dip coating, a wet deposition method, is an effective and straightforward way of thin-film/layers formation. The dipping mixtures are often embedded with inorganic fillers, nanoparticles, or clusters (d<30 nm) that produce a thin film ranging from nm to couple microns. An increase in the volume of solid transfer by the dipping process can open-up a novel 3D near-net-shape production. However, adding larger inorganic particle size (>1µm) or adding a higher solid fraction will increase the solid transfer but may result in a multi-phase heterogeneous mixture. In this work, the physical mechanism of an increased volume of solid transfer with a larger spherical particle size (>5 µm) is investigated. Polymer-based glue and evaporating solvent are mixed to construct the liquid carrier system (LCS). Moderate volume fraction of inorganic particles (20% < ?p < 50%) are added into the LCS solution as solid loading. Three levels of binder volume fraction are considered to investigate the effect of the solid transfer. Cylindrical AISI 304 steel wire with dia 0.81 mm is dipped and the coating thickness, weight, and the surface packing coverage by the particles are measured in our lab. The results presented the influence of volume fraction of inorganic particle and glue composition on the solid transfer from the heterogeneous mixture.

AES study of surface segregation of Ge in amorphous Si1−xGex thin film alloys

2001 ◽  
Vol 495 (3) ◽  
pp. 195-203 ◽  
Author(s):  
J Nyéki ◽  
Ch Girardeaux ◽  
Z Erdélyi ◽  
G.A Langer ◽  
G Erdélyi ◽  
...  
Keyword(s):  
Thin Film ◽  
Surface Segregation

SERS of a-C Thin Film on Ag, Au, Ag0.52-Au0.48 Alloy Nanoparticle Arrays with Normal Particles Size Distribution Formed by Vacuum Thermal Evaporation

2018 ◽  
Vol 386 ◽  
pp. 250-255 ◽  
Author(s):  
Sergey Dubkov ◽  
Alexey Trifonov ◽  
Yuri Shaman ◽  
Evgeny Kitsyuk ◽  
Andrey Savitskiy ◽  
...  
Keyword(s):  
Thin Film ◽  
Particle Size ◽  
Raman Scattering ◽  
Size Distribution ◽  
Thermal Evaporation ◽  
Experimental Studies ◽  
Alloy Nanoparticles ◽  
Nanoparticle Arrays ◽  
Vacuum Thermal Evaporation ◽  
Particles Size Distribution

This paper presents the results of experimental studies of arrays of Ag0.52Au0.48 alloy nanoparticles. Arrays were formed by vacuum-thermal evaporation on an unheated substrate and subsequent low-temperature vacuum annealing. The TEM images of the obtained nanoparticle arrays and corresponding histograms of particle size distribution are shown. The transmission spectra of these arrays showing the displacement of the plasma frequency as a function of the mean particle size are obtained. Spectra of Raman scattering from a thin film of amorphous carbon in presence of AgAu particles are obtained, and a comparative analysis of Raman scattering amplification factors for pure Ag, pure Au and Ag0.52Au0.48 alloy nanoparticles is presented.

COPPER SURFACE SEGREGATION DURING V2O5 THIN FILM DEPOSITION

2004 ◽  
Author(s):  
M. M. AHADIAN ◽  
A. IRAJI-ZAD ◽  
M. GHORANNEVISS ◽  
M. HANTIZADEH
Keyword(s):  
Thin Film ◽  
Surface Segregation ◽  
Thin Film Deposition ◽  
Copper Surface ◽  
Film Deposition

Silicidation in Pd/Si thin film junction—Defect evolution and silicon surface segregation

2007 ◽  
Vol 142 (2-3) ◽  
pp. 62-68 ◽  
Author(s):  
S. Abhaya ◽  
G. Amarendra ◽  
G. Venugopal Rao ◽  
R. Rajaraman ◽  
B.K. Panigrahi ◽  
...  
Keyword(s):  
Thin Film ◽  
Silicon Surface ◽  
Surface Segregation ◽  
Defect Evolution ◽  
Si Thin Film

Determination of band gap in polycrystalline Si/Ge thin film multilayers

2006 ◽  
Vol 21 (3) ◽  
pp. 623-631 ◽  
Author(s):  
S. Tripathi ◽  
R. Brajpuriya ◽  
C. Mukharjee ◽  
S.M. Chaudhari
Keyword(s):  
Thin Film ◽  
Particle Size ◽  
Band Gap ◽  
Quantum Confinement ◽  
Near Infrared ◽  
Quantum Confinement Effect ◽  
Multilayer Structures ◽  
Absorption Measurements ◽  
Gap Values

The valence band (VB) photoemission supported by ultraviolet–visible–near infrared spectroscopy techniques were used to determine the band gap values of polycrystalline Si and Ge single layers as well as of Si/Ge multilayer structures. The band gap values obtained from VB photoemission measurements for these structures were found to be much larger than their corresponding bulks and to match well with those determined from standard optical absorption measurements. In each case, the VB offset values were obtained by considering the corresponding VB maximum as a reference. The increase in band gap in case of thin single layers of Si and Ge with respect to bulks were interpreted in terms of quantum confinement effect, while in case of multilayer sample, the effect of various factors such as (i) intermixing leading to the formation of SiGe alloy, (ii) roughness at the interface, (iii) particle size, and (iv) strain seem to play an important role in the observed change in band gap.

Effect of particle size on surface segregation

1988 ◽  
Vol 27 (10) ◽  
pp. 770-772
Author(s):  
A. S. Ivanov ◽  
S. A. Borisov
Keyword(s):  
Particle Size ◽  
Surface Segregation ◽  
Effect Of Particle Size
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