scholarly journals A scanning Hall probe microscope for high resolution, large area, variable height magnetic field imaging

2016 ◽  
Vol 87 (11) ◽  
pp. 113702 ◽  
Author(s):  
Gorky Shaw ◽  
R. B. G. Kramer ◽  
N. M. Dempsey ◽  
K. Hasselbach
Keyword(s):  
Magnetic Field ◽  
High Resolution ◽  
Hall Probe ◽  
Large Area ◽  
Probe Microscope ◽  
Magnetic Field Imaging ◽  
Field Imaging

High-resolution magnetic field imaging with a nitrogen-vacancy diamond sensor integrated with a photonic-crystal fiber

2016 ◽  
Vol 41 (3) ◽  
pp. 472 ◽  
Author(s):  
I. V. Fedotov ◽  
S. M. Blakley ◽  
E. E. Serebryannikov ◽  
P. Hemmer ◽  
M. O. Scully ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Photonic Crystal ◽  
High Resolution ◽  
Photonic Crystal Fiber ◽  
Nitrogen Vacancy ◽  
Crystal Fiber ◽  
Magnetic Field Imaging ◽  
Field Imaging

scholarly journals Open Localization in 3D Package with TSV Daisy Chain Using Magnetic Field Imaging and High-Resolution Three-Dimensional X-ray Microscopy

2021 ◽  
Vol 11 (17) ◽  
pp. 8148
Author(s):  
Yuan Chen ◽  
Ping Lai ◽  
Hong-Zhong Huang ◽  
Peng Zhang ◽  
Xiaoling Lin
Keyword(s):  
Magnetic Field ◽  
High Resolution ◽  
Failure Analysis ◽  
Complex Structure ◽  
Three Dimensional ◽  
X Ray ◽  
Defect Localization ◽  
Magnetic Field Imaging ◽  
3D Package ◽  
Field Imaging

With the development of 3D integrated packaging technology, failure analysis is facing more and more challenges. Defect localization in a 3D package is a key step of failure analysis. The complex structure and materials of 3D package devices demand non-destructive defect localization technology for full packages. Magnetic field imaging and three-dimensional X-ray technology are not affected by package material or form. They are effective methods to realize defect localization on 3D packages. In this paper, magnetic field imaging and high-resolution three-dimensional X-ray microscopy were used to localize the open defect in a 3D package with a TSV daisy chain. A two-probe RF method in magnetic field imaging was performed to resolve isolation of the defect difficulties resulting from many different branches of TSV daisy chains. Additionally, a linear decay method was used to target sub-micron resolution at a long working distance. Multiple partition scans from a high-resolution 3D X-ray microscopy with a two-stage magnification structure were used to achieve sub-micron resolution. The open location identified by magnetic field imaging was consistent with that identified by a three-dimensional X-ray microscope. The opening was located on the top metal in the proximity of the fifth via. Physical failure analysis revealed the presence of a crack in the top metal at the opening location.

Magnetic Field Imaging on Stacked Flash Memories by Laser Probing and SQUID Scanning

2017 ◽  
Author(s):  
K. Sanchez ◽  
G. Bascoul ◽  
F. Infante ◽  
N. Courjault ◽  
T. Nakamura
Keyword(s):  
Magnetic Field ◽  
Failure Analysis ◽  
Two Dimensions ◽  
Analysis Tool ◽  
Active Device ◽  
Current Path ◽  
3D Packaging ◽  
Magnetic Field Imaging ◽  
The Magnetic Field ◽  
Field Imaging

Abstract Magnetic field imaging is a well-known technique which gives the possibility to study the internal activity of electronic components in a contactless and non-invasive way. Additional data processing can convert the magnetic field image into a current path and give the possibility to identify current flow anomalies in electronic devices. This technique can be applied at board level or device level and is particularly suitable for the failure analysis of complex packages (stacked device & 3D packaging). This approach can be combined with thermal imaging, X-ray observation and other failure analysis tool. This paper will present two different techniques which give the possibility to measure the magnetic field in two dimensions over an active device. Same device and same level of current is used for the two techniques to give the possibility to compare the performance.

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 ◽  
Author(s):  
A. Orozco ◽  
N.E. Gagliolo ◽  
C. Rowlett ◽  
E. Wong ◽  
A. Moghe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Fault Isolation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Current Location ◽  
Geometrical Information ◽  
Magnetic Field Imaging ◽  
Silicon Vias ◽  
Non Destructive ◽  
Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

A multi-magneto-inductive sensor array system for real-time magnetic field imaging of ferromagnetic targets

2021 ◽  
Vol 92 (3) ◽  
pp. 035113
Author(s):  
Huan Liu ◽  
Changfeng Zhao ◽  
Xiaobin Wang ◽  
Zehua Wang ◽  
Jian Ge ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Real Time ◽  
Sensor Array ◽  
Inductive Sensor ◽  
Magnetic Field Imaging ◽  
Field Imaging

scholarly journals Magnetic field imaging of a model electric motor using polarized pulsed neutrons at J-PARC/MLF

2017 ◽  
Vol 862 ◽  
pp. 012008 ◽  
Author(s):  
K Hiroi ◽  
T Shinohara ◽  
H Hayashida ◽  
J D Parker ◽  
K Oikawa ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Electric Motor ◽  
Magnetic Field Imaging ◽  
Field Imaging

scholarly journals Comparison of magnetic field imaging (MFI) and magnetic field simulation of silicon solar cells

2019 ◽  
Author(s):  
Ulli Zeller ◽  
Dominik Lausch ◽  
Matthias Pander ◽  
Kai Kaufmann ◽  
Sebastian Slaby ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Solar Cells ◽  
Silicon Solar Cells ◽  
Magnetic Field Simulation ◽  
Field Simulation ◽  
Magnetic Field Imaging ◽  
Field Imaging

Evaluation of the Quality of Solder Joints Within Silicon Solar Modules Using Magnetic Field Imaging (MFI)

2020 ◽  
Author(s):  
Kai Kaufmann ◽  
Dominik Lausch ◽  
Chia-Mei Lin ◽  
Maik Rudolph ◽  
Daniel Hahn ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Solder Joints ◽  
Magnetic Field Imaging ◽  
Field Imaging
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